Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

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Dr. Hamid Azimi

  • Corporate VP, Director of Substrate Packaging TD
  • Intel

Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.

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Intel

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Markus Keil

  • VP Global Semiconductor Operations / COO
  • Nextlens

Over 20 years Semiconductor Operations experience in Memory (Hitachi Semiconductor), iDM (AMD) and Foundry (GlobalFoundries) leading their Wafer Fab and adv. WLP package activities.

5 years CEO of a SME dealing with design and marketing leading edge optical inspection and review systems for Semiconductor customers.

Most recently responsible for the global operations and Supply chain management of a leading Power Semiconductor manufacturer (Littelfuse) integrating a recent acquisition and building the right supply chain for future growth and profitability.

Holds a degree of applied physics of College of Wiesbaden/Germany, is married and has 2 children.

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Nextlens
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Dato Seri Lee Kah Choon

Dato’ Seri Lee Kah Choon is currently the Independent Non-executive Chairman of Aemulus Holdings Berhad, a company listed on Bursa Malaysia, which engages in the design & assembly of automated test equipments in the electronic industry.

He is the Chairman of Federal Oats Mills, South East Asia’s largest oats manufacturer producing quality oats & oats based products for the Asian, Middle East and African markets.

Dato Seri Lee also sits on the boards of Nationgate Holdings Berhad & L&P Global Berhad (both listed on Bursa Malaysia) as their Senior Independent Director.

Additionally, Dato Seri Lee is a member of the Investment Committee of Areca Capital, a licensed fund manager for individuals, corporations and institutions.

Industries covered by these companies include: electronic testing equipments manufacturing; electronic manufacturing services; box & crate packaging; food production; wealth management.

Dato Seri Lee had served as board member of various federal & state government linked companies & corporations; Parliamentary Secretary; Member of Parliament & Municipal Councillor.

He was a practicing lawyer with his own private legal practice from 1987 to 2004, after being called to the Bar of Malaya in 1987 and Bar of England & Wales in 1986.

Dato’ Seri Lee holds a LLB from the Southampton University, UK and a MA from the City University, London.

Dato Seri Lee is a Barrister at Law (Middle Temple) & a Certified Financial Planner.

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Aemulus

TBC

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Dr. Xiaoning Qi

Xiaoning Qi is the Vice President of Alibaba Group. Previously, he held senior management and technical positions in companies such as Intel, designing integrated circuits and systems. He sits on the board of directors at several international organizations including RISC-V International Association, CHIPS Alliance, OpenHW, EEMBC, etc. He is a member of Global Semiconductor Alliance (GSA) Advisory Board, a member of GSA Asia-Pacific Leadership Council and GSA CEO Council. He has published more than fifty technical papers, a book, and has delivered over three dozen invited talks. He holds two US patents. Xiaoning received his Ph.D. degree in Electrical Engineering from Stanford University.

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Alibaba Group
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Jennifer Zhao

  • GM & EVP for Advanced Optical Sensors Division
  • ams

Jennifer Zhao joined ams as EVP and GM for Advanced Optical Sensors Division in 2017. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Currently Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater China and South East Asia.

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ams

ams is a global leader in the design and manufacture of advanced sensor solutions. Our mission is to shape the world with sensor solutions by providing a seamless interface between humans and technology. ams’ high-performance sensor solutions drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. Products include sensor solutions, sensor ICs, interfaces and related software for consumer, communications, industrial, medical, and automotive markets. With headquarters in Austria, ams employs about 9,000 people globally and serves more than 8,000 customers worldwide.

Leading manufacturers around the globe rely on ams’ sensing know-how for advanced systems design. For ams, “Sensing is Life” and our passion is in creating the sensor solutions that make devices smarter, safer, convenient and more environment-friendly. ams’ sensor solutions are at the heart of the products and technologies that define our world today –from smartphones and mobile devices to smart homes and buildings, industrial automation, medical technology, and connected vehicles. Our products drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. We offer sensors (including optical sensors), interfaces and related software for consumer, communications, industrial, medical, and automotive markets.

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Vincent Dicaprio

  • VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
  • Applied Materials

Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES.

Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions.

With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging.

For more information please visit: linkedin.com/in/vincentdicaprio

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Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Bernard Lim

Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).

For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/

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Appscard Groups AS

APPSCARD is a Norwegian company with its global operation based out of Malaysia. Appscard provides the World’s first “Government Grade Biometric Computer on Card”. The solution integrated in an ISO-standard smart card format with a large and physically flexible fingerprint sensor designed for use throughout entire populations. A complete local ID-system that does not compromise security or user privacy and works conveniently and securely for very close to 100% of any given population. APPSCARD replaces all of today’s identity keys, including pin codes, passwords, code tokens, simple non-biometric access cards, signatures, physical keys etc, all of which are easily compromised. And, the system is not dependent on databases or communication lines, only the user’s biometrics. Thus, all dominant sources of the massive challenges facing us today are effectively removed.

For more information please visit: www.appscard.com

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CJ Hsieh

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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ASPEED

Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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Wei Wang

Career

  • 2016 – now Assistant president 、 Director of R&D and Operation in TSARI
  • 2011 – 2016 General manager in MicRiver Information Systems
  • 2001- 2010 AP Manager, BP, PM in Delphi Packard Electric Systems

Study

Graduated from Automotive Engineering Department of Tsinghua University in 1999, and Olin Business School of Washington University in St. Louis in 2008.

Other information

Senior engineer in management domain; Member of JS-SAE automobile intelligent manufacturing committee & Industry Standard Committee of Automotive Intelligent Manufacturing

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Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
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Dr. Xiaoxin Qiu

Xiaoxin Qiu received her BE and ME degrees from Tsinghua University, P. R. China, in 1990 and 1991, respectively; and her Ph.D. from University of Southern California, Los Angeles, in 1996, all in Electrical Engineering.

From 1996 to 2001, she was with the Broadband Wireless Systems Research Department of AT&T Laboratories in Middletown, NJ, USA. In January 2001, she joined Mobilink Telecom Inc, which became a part of Broadcom Corporation in 2002. During her tenure in Broadcom, she served as the Vice President of Systems Design Engineering, and was responsible for cellular modem development and productization as well as developing next generation cellular IoT/M2M/NB-IoT devices and platforms.

In 2016, she joined WNC, a Taiwanese ODM company, serving as the CTO of Software and Vice President of Technical Marketing. In this capacity, Xiaoxin was in charge of creating the 5G product line from scratch and was responsible for the successful product design-ins in Verizon and a handful of European operators.

In 2018, Xiaoxin joined UniSoC Corp in China as Chief Technology Officer, responsible for defining the company technology and product roadmaps, and leading the R&D effort.

In 2019, she started and served as CEO of Axera Technology Co. Ltd., a start-up company focusing on creating AI enabled, high performance vision processing chips for a variety of public safety, smart city, smart home, smart industrial applications.

Xiaoxin is a senior member of the IEEE, and was elected Broadcom Distinguished Engineer in 2008 due to her outstanding contributions in cellular technology development in Broadcom.

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Axera Technology Co., Ltd

Axera is a high-tech semiconductor company focused on developing world class Artificial Intelligence (AI) SoCs, for high-performance low-power computer vision applications. These chips are particularly suitable for today’s AIoT products, extending the AI intelligence from the cloud to the edge as well as end devices. They can be used in a vast array of applications such as smart cities, smart transportation, smart manufacturing and smart homes, with the goal to convenience people’s life and make our society a better and safer place.

AX630A:A high-performance low-power Computer Vision AI SoC

axerapr@axera-tech.com
https://www.axera-tech.com/

Add: 4th Floor, Raycom Info Tech Tower A, No. 2 Kexueyuan South Road, Haidian District, Beijing, 100190 PRC

General phone number and fax 010-82622584

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Martin Weigert

  • VP & GM Industrial Fiber Products Division
  • Broadcom

Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber optic and sensor products targeting the industrial, automotive and medical market. Martin Weigert worked for Siemens/Osram/Infineon/Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Broadcom. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies GmbH in Munich, Avago Technologies Fiber Austria GmbH in Vienna and a member of the supervisory board at CISES (Chinese International Semiconductor Executive Summit).

20 years experience in Fiber Optics

1994 -1997 – Process development MEMS
1997 -1998 – Task force leader production ramp-up
1998 –1999 – Project leader optical SMD devices
1999 –2000 – Marketing Manager Automotive LED
2001 –2004 – Director Development Fiber Optics
2004 –2006 – Director Marketing POF
2006 –2007 – Director Product Line Manager (R&D+Marketing) at Infineon
Since 2008 – General Manager Industrial Fiber Optics at Avago Technologies
Since 2009 – Managing Director “Avago Technologies Fiber GmbH”
2011-2017 – Member of the supervisory board at MIC AG
Since 2012 – Managing Director “Avago Technologies Fiber Austria GmbH”
2014-2016 – Vice President & General Manager at Avago Technologies
Since 2016 – Vice President & General Manager at Broadcom

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Broadcom

Coming soon…

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Amy Leong

  • Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
  • Formfactor

Amy Leong has been with FormFactor since October 2012. Prior to this, Amy was the VP of Marketing at MicroProbe from April 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Ms. Leong worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the ASSP system-on-chip and microcontroller markets. From 2003 to 2008, Ms. Leong worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, Ms. Leong worked in a variety of semiconductor process engineering and product marketing roles at KLA-Tencor and IBM.

Ms. Leong holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.

 

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Formfactor

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.

FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems, quantum cryogenic systems, and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips.

Visit www.formfactor.com.

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Dr. Qingchun Zhang

Dr. Q. Jon Zhang is currently the distinguished professor in Fudan University. He was the Principal Engineer for WBG technologies in Alpha and Omega Semiconductors (AOS), USA, leading R&D and production activities on SiC devices, working with a world-leading CMOS foundry to commercialize MOSFETs and Diodes on SiC. Prior to AOS, he was the director of power device technology at the PowerAmerica Institute reviewing the technical proposals and managing wide bandgap power devices, modules and power electronics projects in order to accelerate the adoption of next generation SiC and GaN power electronics. He also served as the adjunct professor of the Department of Electrical and Computer Engineering at NC State University. Before joining NCSU, he has been the Senior Scientist at Wolfspeed, a Cree company for 13 years, leading various projects in both R&D and production in SiC power devices, playing a critical role in the commercialization of all generations of SiC Schottky diodes and MOSFETs. Among his many milestones are demonstrating the industry’s first reported SiC trench MOSFET, 12 kV IGBTs, trench Schottky diode, drift-free BJT, 12 kV GTOs, SiC CIMOSFETs with the record device performance, latest generation of 650V and 1700V SiC MOSFETs for power modules, etc. He received his B.S. and M.S. degrees from Tsinghua University, China, respectively, and a Ph.D. degree from the University of South Carolina. He is the co-author of over 100 technical papers and conference presentations, and is the first or co-inventor on more than 80 US patents. He serves as a technical committee member of ISPSD, reviewer of various journals, and IEEE member.

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Fudan University
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Andy Chuang

Mr. Chuang received his M.S. degrees in Electrical Engineering of National Tsinghua University. After graduated, he joined UMC R&D to start his professional career. Starting from R&D to give him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales and expat to Europe to manage key customers. Completely training to make him realize wafer business and supply chain. After UMC, he joined EDA vendor, Synopsys. This experience helped him connecting chip design to wafer manufacturing. After that, he joined CSMC in China as VP of marketing and sales. He led company to have creative ideas to customize BCD processes targeting to specific application and won the China market, such as Class A/B, Class D, Charger, PMIC, LED display, and LED lighting. In 2013, he joined Episil, started business in compound semiconductor (SiC and GaN-on-Si). He is the one who run both SiC and GaN-on-Si at the same, and delivered supreme manufacturing cycletime, production yield to customers. He started new career in GaN Systems from 2022. GaN Systems is a trusted company which can deliver GaN devices to Automotive and High Rel application. GaN Systems enables power conversion companies to revolutionize their industries and transform the world.

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GaN Systems
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Dr. Yongxiang Wen

Process Technology Director of Hangzhou Silan Microelectronics Co., LTD., responsible for the manufacturing and development of IC products, With 35 years of experience in integrated circuit manufacturing, responsible for the development of SL’s BICMOS\BCD products and processes, VDMOS, IGBT 、SIC products and processes. There are 6 patents (No.1 writer)authorized in the United States and 70 patents authorized in China.

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Hangzhou Silan Microelectronics Co., Ltd.
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Chang Fu

  • Advanced Module R&D Dep., Deputy Director
  • HLMC

Chang Fu, current Deputy Division Director in Shanghai Huali Microelectronics / Integrated Circuit Corporation , member of Huahong Group, plays a role in Advanced Module Technology Development.

Prior to Huali, Mr. Fu has over 30 years of experiences regarding module process development, R&D, fab operations in multiple fabs. He had made critical contribution to the fab establishment in ASMC Shanghai, Chartered Semiconductor Manufacturing Singapore (now Global Foundry), UMCi (Singapore), convert new technologies into mass production and continuous developing. He also engaged in the Technology Development in GSMC (HHGrace now), another member of Huahong Group.

Mr. Chang Fu obtains a Bachelor’s degree in Electrical Engineering from FuDan University, and a Master of Science degree in Electrical Engineering from National University of Singapore.

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HLMC
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Prof. Shaojun Wei

Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.

Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).

Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).

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IME, Tsinghua University

The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.

Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.

The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.

Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.

After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.

Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.

With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.

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Prof. Tianchun Ye

Secretary General of China Integrated Circuit Innovation Alliance

Academician of the International Eurasian Academy of Sciences

President of IC branch of China Semiconductor Industry Association

 

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Institute of Microelectronics of the Chinese Academy of Sciences

The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.

Company website: www.ime.ac.cn

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