Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

Dr. Marvin Liao photo
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Dr. Marvin Liao

  • ISES Board Member
  • ISES

Education :

  • Ph.D., Materials Science, University of Texas, USA, 1989
  • Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979

Experience :

  • TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
  • TSMC, Special Project, 2009 ~ 2010
  • TSMC, Fab 6 Director, 2003 ~ 2009
  • Chartered Semiconductor, 1997 ~ 2002 (Singapore)
  • Applied Materials, 1994 ~ 1997 (USA)
  • SGS Thomson Microelectronics, 1990 ~1994 (USA)
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ISES

Established in 2010, the International Semiconductor Industry (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today:  https://isesglobal.com/

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Dr. Hamid Azimi photo
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Dr. Hamid Azimi

Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.

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Intel Corporation

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Dr. Wei-Chung Lo photo
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Dr. Wei-Chung Lo

Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.

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Industrial Technology Research Institute (ITRI)

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Tomomitsu Maoka photo
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Tomomitsu Maoka

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Resonac Corporation

On January 1, 2023, Showa Denko K.K. and Showa Denko Materials Co., Ltd. merged and transformed themselves into newly integrated company “Resonac”. Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global No.1 semiconductor materials supplier (except for Si wafer). In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.

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Dr. Koukou Suu photo
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Dr. Koukou Suu

Dr. Koukou Suu graduated and received Ph.D degree in Engineering from Tohoku University, Japan in 1988 and 1993 respectively. He joined ULVAC, Inc. in 1993 and since then has been leading and engaging with developments of numerous semiconductor and electronics technologies including emerging non-volatile memories, high-K capacitors, LED, power devices, thin-film Li-battery as well as 3D packaging manufacturing technologies. He was General Manager of Institute of Semiconductor and Electronics Technologies of the company from 2008 to 2014. Currently he is Executive Officer and Senior Fellow of ULVAC, Inc. as well as President and CEO of ULVAC Technologies, Inc, a company representing ULVAC in North America. He is also an Adjunct Professor of Shanghai Institute of Microsystem and Information Technology of Chinese Academy of Science as well as an Adjunct Industrial Professor of University of South Australia.

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Entegris
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Tad Suhara photo
  • Keynote Speaker
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Tad Suhara

Education:

  • Bachelor, Economics, Doshisha University, Japan, 1983

Experience:

  • TSSC, CEO, 2023/5~
  • JSR Corporation, Managing Officer, 2019~2023
  • Screen Semiconductor Solutions , CEO, 2014~2019
  • Dainippon Screen Manufacturing , 1983~2014
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TSSC

TSSC is a consulting company to support Semiconductor and Semiconductor Supply Chain for enabling continuous Semiconductor industry’s growth.

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