Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

Dr. Marnix Tack photo
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Dr. Marnix Tack

  • CTO & VP Business Development
  • BelGaN

Dr. Tack got a MSc degree in Electronic Engineering in 1984 from the Univ of Gent (Belgium) and a PhD degree in Microelectronics in 1990 from the Univ of Leuven & imec (Belgium). He got additional degrees in international business management and innovation leadership from the Vlerick Business School (Belgium), INSEAD (France), MIT (US) and IMD (Swiss). He joined MIETEC, a semiconductor company in Belgium in 1990, that became Alcatel Microelectronics, and was acquired by AMI Semiconductor in 2002 and ON Semiconductor in 2008.

In Feb 2022 he joined BelGaN that acquired part of onsemi in Belgium, as CTO and VP Business Development.

Throughout the past 30+ years he was leading global professional teams in various fields of semiconductor R&D and Innovation, including Si CMOS & BCD, power MOSFETs and GaN. He also took the lead in setting up and driving a corporate innovation business process and global Open Innovation partnerships in the field of novel semiconductor technologies and products

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BelGaN

Be a leading automotive qualified open foundry in the Wide Band Gap ecosystem.

Enabling our customers to develop and manufacture unique solutions for a sustainable electrified future.

Creating value through our employees’ enthusiasm, talents and commitment.

BelGaN, as a WBG foundry in Europe, enables and services a rapidly expanding GaN-ecosystem in Europe (‘GaN-Valley’) and beyond with innovative and high-quality WBG semiconductor technologies and a highly efficient value-add 6 and 8 inch manufacturing facility. BelGaN adds unique services such as customer-driven Technology-as-a-Service (customized processes), Manufacturing-as-a-Service, and Quality-as-a-Service to the traditional foundry business model whereas we cooperate with suppliers and customers to deliver automotive quality products to the market. BelGaN develops and bring-to-market a rich roadmap of GaN & SiC platforms, driven by our customers’ needs and our core strengths and vision. We partner with leading universities and RTO’s in an Open Innovation model to prepare our innovation roadmap and bring differentiating innovations to our customers.

Manufacturing Facility: Wafer fab with over 4500 m2 of clean room space, located on a 44.000 m2campus.

Fab: 6 & 8 inch (planned).

Production: GaN Technologies & 0.35 µm to 2 µm Low, Medium, and High Voltage Analog CMOS and BCD Technologies.

BelGaN BV
Westerring 15
9700 Oudenaarde
Belgium

www.belgan.be

+32 55 332211

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Ralf Bornefeld

  • SVP Power Semiconductors & Modules
  • Bosch

Ralf Bornefeld is Senior Vice President with responsibility for business line and engineering of Power Semiconductors & Modules at Bosch. He joined Bosch in November 2019.

Before he held various management positions at Infineon Technologies AG: senior director technology in frontend production from 2005-2008, senior director engineering of automotive sensors until 2011 and finally vice president and general manager business line automotive sensors.

Ralf started his career at Elmos Semiconductor in 1992 as a technology development engineer. Afterwards he took several management positions until end of 2004, mostly serving as vice president of R&D and eventually as vice president of business line microsystems.

Ralf Bornefeld was born in Schalksmuehle, Germany, in 1964. He graduated with a degree in Electrical Engineering from Technical University of Dortmund in 1992.

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Bosch

The Bosch Group is a leading global supplier of technology and services. It employs roughly 402,600 associates worldwide (as of December 31, 2021). The company generated sales of 78.7 billion euros in 2021. Its operations are divided into four business sectors: Mobility Solutions, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 440 subsidiary and regional companies in some 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 128 locations across the globe, Bosch employs some 76,100 associates in research and development, of which more than 38,000 are software engineers.

The company was set up in Stuttgart in 1886 by Robert Bosch (1861–1942) as “Workshop for Precision Mechanics and Electrical Engineering.” The special ownership structure of Robert Bosch GmbH guarantees the entrepreneurial freedom of the Bosch Group, making it possible for the company to plan

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Dr. Rainer Kaesmaier

Since 2018 Dr. Rainer Kaesmaier is Managing Director for the Global Product Group Semiconductors of Hitachi Energy, leading the semiconductor business with its global manufacturing and R&D footprint for the power semiconductor product portfolio which compromises GTOs, IGBTs, IGCTs, Thyristors, Diodes for market segments such as energy transmission & distribution, transportation & rail, renewable, industry and e-mobility. He is a semiconductor industry veteran having held various management and executive positions in the sector for more than 25 years, covering areas of global responsibility in business strategy and development, business transformation, technology and engineering, operations and production, R&D, as well as sales and marketing. After stations at Siemens, Infineon, Qimonda, and the European semiconductor manufacturer LFoundry, he assumed the responsibility for the global semiconductor business of Hitachi Energy. In addition to that, Rainer is since 2019 also member of the management board for Hitachi Energy Switzerland Ltd.

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Hitachi Energy Ltd.

We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, IGBTs and RoadPakTM modules, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. We have one of the most diverse semiconductor portfolios that includes thyristors, diodes, GTOs, IGCTs, MOSFETs and IGBTs, which are manufactured at our facilities in Lenzburg, Switzerland and Prague, Czech Republic. Our research team continues pushing the boundaries of what is possible, using silicon and silicon carbide (SiC) technology to innovate the next generation of power electronics devices. Our advanced semiconductor technology brings unprecedented control to HVDC transmission systems. We are the heart of traction converters for high speed trains, metros and diesel-electric locomotives. Pumps, fans, roller tables, hoist and winches found throughout industry rely on us, and the world is able to enjoy greener mobility because we power the next generation of e-vehicles.

Hitachi Energy Switzerland Ltd.
Semiconductors
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland

Phone: +41 58 586 14 19
Fax: +41 58 586 13 06
Email: salesdesksem@hitachienergy.com
www.hitachienergy.com/semiconductors

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Denis Marcon

Denis Marcon received a M.S. degree from the University of Padova in 2006. Subsequently, he received the degree of Doctor in Engineering (Ph. D.) from the Catholic University of Leuven and imec with the thesis entitled “Reliability study of power gallium nitride based transistors” in 2011. He is leading author or co-author of more than 50 journal papers or international conference contributions.

After his Ph.D. graduation, he has been leading projects aiming to develop GaN HEMTs for several applications (RF and power switching). Thereafter, he has joined the business development team of Imec where he was directly responsible for the partnerships with imec in the field of GaN power electronics as well as on dedicated development and manufacturing of Si-based devices, MEMS, sensors and micro-systems,

Today he is the General Manager of Innoscience Europe (subsidiary of Innoscience) and he is directly responsible for Innoscience’s GaN business in Europe.

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Innoscience

Innoscience is an Integrated Device Manufacturer (IDM) founded in December 2015 with the support of international prestigious investors. With the development of new technologies, the electric power grid and power electronic systems across the world are undergoing a massive transformation. Our vision is to create an energy ecosystem with effective and low-cost Gallium-Nitride-on-Silicon (GaN-on-Si) power solutions. In November 2017, Innoscience first established a mass production 8-inch wafer line for GaN-on-Si devices and, in order to fulfill the rapidly growing power demands, Innoscience has inaugurated a new facility in September 2020. As a cutting-edge GaN technology provider, Innoscience’s 1,600+ employees and over 500 R&D experts are dedicated to delivering high performance and high reliability GaN power devices that can be widely used in diverse applications including portable devices, mobile phones, chargers and adapters, electric vehicles (EV) and automotive. For more information, please visit www.innoscience.com.

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Marco Giandalia

Marco Giandalia serves as Vice President IC Design for Navitas Semiconductor and has 25 years experience in the field of Power IC products and technology development in Si and GaN since he received is MSEE in 1996.

Before joining Navitas, Marco led the Energy Saving Product – Design Center at International Rectifier developing innovative products for Off-Line application like motor drive, AC/DC, DC/DC converters. Earlier he was in charge as IC Design Engineer at STMicroelectronics for Smart Power IC product line.

He has been granted several patents for Power IC design solutions and has been author of multiple papers and conferences presentations.

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Navitas Semiconductor

Founded in 2014, Navitas develops ultra-efficient gallium nitride (GaN) semiconductors that are revolutionizing the world of power electronics in terms of efficiency, performance, size, cost and sustainability.

GaN is growing in importance because of its ability to offer significantly improved performance over conventional silicon semiconductors while reducing the energy and the physical space needed to deliver that performance. GaN technology will accelerate the transition to a sustainable future by delivering efficiency improvements, lowering the cost of clean energy and reducing the materials and energy needed to create power semiconductors.

Navitas is the industry leader in GaN with drive, control and protection in a single easy-to-use integrated circuit (IC). Navitas GaNFast ICs are easy-to-use ‘digital in, power out’ building blocks that enable up to one hundred times faster switching speeds while increasing energy savings by as much as 40%.

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Carlos Castro

Carlos Castro serves as Vice President and General Manager GaN for Nexperia and has more than 15 years of experience in power and automotive semiconductors. Prior to joining Nexperia, Carlos led the IGBTs/MOSFETs/SiC discretes business and automotive electronics activities at Littelfuse. Earlier he was in charge of Marketing and Application Engineering for automotive MOSFETs and led the Technical Marketing group for Electric Drive Train at Infineon Technologies. He has been granted several patents for power semiconductor devices and has been author of multiple papers and conferences presentations. Carlos holds a MSc and a PhD in Electrical Engineering from the Technical University of Dortmund, Germany and the University of Granada, Spain.

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Nexperia

Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.

The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.

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Dr. Avi Kashyap

  • VP & GM, Power Solutions, Renesas Electronics
  • Renesas

Dr. Avinash (Avi) Kashyap is the Vice President of the Power BU in the High Performance Computing, Analog and Power Solutions Group at Renesas Electronics. He is responsible for incubating and commercializing new technologies in the power area including wide bandgap, power modules and new generation IGBTs and Si FETs. Avi also leads revenue generation, business development and marketing for N. America and Europe.

Prior to his current role, he was Director of Silicon Carbide and Head of R&D for power discretes at Microchip Technology. Dr. Kashyap led engineering groups ranging from device design, process integration and test. He was responsible for creating product roadmaps and execution of critical silicon and wide bandgap programs including SiC FETs and diodes, Si low voltage FETs, rad-hard FETs and RF power switches.

Previously, Dr. Kashyap was leading several power device programs at the GE Global Research Center in Niskyuna, NY. He has been involved in the development of SiC technology since its infancy for 2 decades including pioneering work on compact modeling, SiC integrated circuits and radiation-hardened devices. He has authored more than 35 peer-reviewed publications and has over 20 patents granted or pending. Dr. Kashyap holds an MS & PhD in electrical engineering from the University of Arkansas, Fayetteville. He is a senior member of the IEEE and a member of the Arkansas Academy of Electrical Engineers.

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Renesas

Renesas Electronics empowers a safer, smarter and more sustainable future where technology helps make our lives easier.

A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live.

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Christophe Maleville

  • CTO Senior, EVP Innovation
  • Soitec

Christophe Maleville has been appointed senior vice president of Soitec’s Innovation.

He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.

Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.

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Soitec

Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.

In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.

With more than 3,500 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness. Soitec’s technologies, projects and industrial capacity make it one of the crown jewels of France’s industrial sector.

Soitec is headquartered in Bernin France. The company was founded 25 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the Euronext, Tech 40 Paris.

For more information please visit:www.soitec.com.

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Edoardo Merli

  • Executive Vice President, Power Transistor Sub-Group Automotive and Discrete Group
  • STMicroelectronics

Edoardo Merli is STMicroelectronics’ Executive Vice President, Power Transistor Sub-Group Vice President and has held this position since January 2022.

Merli joined STMicroelectronics in 1998 as Head of System Architecture in the Telecom Wireline Division. In 2002, he formed and led ST’s WLAN Business Unit.

Merli was appointed Director of the Automotive Product Group in 2007, where he took responsibility for the RF Competence Center & Connectivity Business Unit and subsequently for the Car Radio Business Unit. In 2012, Merli was promoted to Marketing & Application Director for ST’s Automotive and Discrete Group in Greater China and South Asia. In 2016, his responsibilities were extended to include the Company’s automotive activities in Korea. In 2017, Merli was promoted to Power Transistor Macro-Division General Manager and Group Vice President of ST’s Automotive and Discrete Group.

Merli has filed several patents on ADSL, multi-service routers, switches, and
throughput management, and authored numerous publications in the areas of Telecommunications, Automotive, and Connectivity.

Edoardo Merli was born in Parma, Italy, in 1962, and graduated with a degree in Electronic Engineering from University of Bologna in 1989.

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STMicroelectronics

At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of the Internet of Things and connectivity. We are committed to achieving our goal of becoming carbon neutral by 2027. Further information can be found at www.st.com.

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Primit Parikh

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Transphorm

Transphorm, Inc., a global leader in the GaN revolution, designs and manufactures high performance and high reliability GaN semiconductors for high voltage power conversion applications. Having one of the largest Power GaN IP portfolios of more than 1,000 owned or licensed patents, Transphorm produces the industry’s first JEDEC and AEC-Q101 qualified high voltage GaN semiconductor devices. The Company’s vertically integrated device business model allows for innovation at every development stage: design, fabrication, device, and application support. Transphorm’s innovations are moving power electronics beyond the limitations of silicon to achieve over 99% efficiency, 40% more power density and 20% lower system cost. Transphorm is headquartered in Goleta, California and has manufacturing operations in Goleta and Aizu, Japan.

For more information, please visit www.transphormusa.com.
Follow us on Twitter @transphormusa and WeChat @ Transphorm_GaN.

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Joseph Roybal

  • Senior Vice President of Global Backend Operations
  • Wolfspeed

Joseph Roybal is the Senior Vice President of Global Backend Operations at Wolfspeed aligning backend manufacturing roadmaps, production strategies, and capital allocation to scale efficiently with Wolfspeed’s exponential growth. He leads an expanding worldwide team focused on systemic manufacturing solutions, SiC package innovation, strategic partnerships with OSATs, and effective product manufacturing solutions for all Wolfspeed businesses and major SiC backend operations.

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Wolfspeed

Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.

Wolfspeed® is a registered trademark of Wolfspeed, Inc.

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