Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

CJ Hsieh photo
  • Keynote Speaker
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CJ Hsieh

Experiences:

  • Advisory board, ISES Taiwan
  • Co-chair of Test Committee, SEMI Taiwan
  • General Manager, INTEL Innovation Tech. Ltd.
  • Spokesperson, INTEL Taiwan
  • Consulting Committee, National QUEMOY University
  • VP of Global Operations, LANTIQ Deutschland GmbH
  • GM & VP of Professional Services Lab, SPIROX Corp.
  • AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
  • Technical Manager of CPU / Memory Design, UMC
  • Project Leader of EDA DFT, SYNTEST Tech. Ltd.

Education:

  • MSEE, University of Southern California, Los Angeles, USA
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ASPEED

Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.

ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.

Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.

Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.

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Andy Chuang

Mr. Chuang received his M.S. degrees in Electrical Engineering of National Tsinghua University. After graduated, he joined UMC R&D to start his professional career. Starting from R&D to give him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales and expat to Europe to manage key customers. Completely training to make him realize wafer business and supply chain. After UMC, he joined EDA vendor, Synopsys. This experience helped him connecting chip design to wafer manufacturing. After that, he joined CSMC in China as VP of marketing and sales. He led company to have creative ideas to customize BCD processes targeting to specific application and won the China market, such as Class A/B, Class D, Charger, PMIC, LED display, and LED lighting. In 2013, he joined Episil, started business in compound semiconductor (SiC and GaN-on-Si). He is the one who run both SiC and GaN-on-Si at the same, and delivered supreme manufacturing cycletime, production yield to customers. He started new career in GaN Systems from 2022. GaN Systems is a trusted company which can deliver GaN devices to Automotive and High Rel application. GaN Systems enables power conversion companies to revolutionize their industries and transform the world.

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GaN Systems
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Ray Yang

  • Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)
  • ITRI

Education:

  • 1997 MBA / Tel-Aviv International School of Management, Israel

Experience:

  • Business Development Director, Office of Business Development, ITRI
  • SEMI Taiwan PKG&TEST, MEMS & Sensors and Smart Manufacturing committee member
  • Advisor to Horizon Europe “International Cooperation in Semiconductors” project
  • Principal investigator of semiconductor international collaboration and compound semiconductor working groups, ITRI / ISTI
  • Advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” project
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ITRI

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

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Ian Hsu

  • Director IC Packaging Technology Development
  • MediaTek
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MediaTek

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do.

Visit www.mediatek.com for more information.

Telephone: +886-3-567-0766 ( more sites )
Email: https://corp.mediatek.com/about/contact-us

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Dr. Akshay Singh

Dr. Akshay Singh is Vice President of Advanced Packaging Technology Development at Micron. He joined Micron in 2006. He leads a global team that is responsible for delivering advanced memory packaging solutions for compute, storage, mobile and embedded markets. Prior to joining Micron, Akshay worked at a startup developing actuators and sensors based on novel electroactive polymers. Akshay holds master and doctoral degrees in mechanical engineering from Louisiana State University in US and bachelor degree in mechanical engineering from Maharaja Sayajirao University in India.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Jian Zhang

Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.

Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.

Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work

Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University

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Qualcomm

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

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Eric Lee

Eric Lee is the President of Sales Group Scientech Corp. I have been working with Scientech Corp. since 2004. Prior to Scientech, Eric worked for UMC Taiwan and UMC Singapore from 1995 to 2004. Along with the role with Scientech, Eric is engaged with National Taiwan University of Science and Technology as a part-time professor in Advanced Packaging Master Program.

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Scientech

Scientech Corporation was established in Taipei, Taiwan in 1979.

What we do: Industries we serve: Semiconductor (front-end, back-end and GaAs), Flat Panel Display, LED, Data Storage, Scientific Instruments and high-tech related industries.

Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech Corporation has launched the development of wet process equipment in 2003. Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet’s 2.5D/3D packaging process technology and smoothly introduced into mass production.

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Samuel Liu

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Skymizer Taiwan, Inc.

Skymizer provides AI-on-chip system software subscription services, including compilers, calibrators, runtime systems, and various AI models (Model Zoo) to the complete source code of the basic application (application). Skymizer also provides customize software and relevant source code for the IC design company.

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Dr. Yu-Po Wang

  • VP Corporate R&D Center
  • SPIL
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SPIL
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Kam Lee

  • eputy Head of TSMC Advanced Packaging Technology and Service.
  • TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Dr. Yu-Hua Chen

Education:

  • Ph.D. Chemistry, 2001, National Taiwan University

Experience:

  • 2012~2021, Vice President, Unimicron Technology Corp.
  • Advanced substrate, panel level RDL and glass substrate Technology
  • 2001~2012, Deputy R&D Director. ITRI/EOSL
  • 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
  • Chip embedded in rigid and flexible substrate technology
  • Flexible LED lighting package technology
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Unimicron
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Yens Ho

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Vanguard
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