Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

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Deepak Kulkarni

  • Senior Fellow Advanced Packaging
  • AMD

Deepak Kulkarni is a Fellow, Advanced Packaging at AMD. Deepak has over 15 years of experience in packaging technology development. Over the years, he has held several leadership positions driving substrate technology development and yield improvement. Prior to joining AMD, Deepak was Senior Director of packaging yield at Intel Corporation. He holds 17 patents and nineteen publications on various aspects of packaging such as 2.5D/3D architectures, DFM/DFY and AI techniques applied to yield management. His contributions to the semiconductor industry have been recognized by an Intel Achievement Award, Next 5% award (AMD) and best paper award (ITHERM). Deepak holds a PhD from the University of Illinois Urbana-Champaign with a major in mechanical engineering and a minor in computational science.

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AMD

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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Curtis Zwenger

Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He is currently responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.

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Amkor Technology, Inc.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Jennifer Zhao

  • GM & EVP for Advanced Optical Sensors Division
  • ams

Jennifer Zhao joined ams as EVP and GM for Advanced Optical Sensors Division in 2017. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Currently Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater China and South East Asia.

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ams

ams is a global leader in the design and manufacture of advanced sensor solutions. Our mission is to shape the world with sensor solutions by providing a seamless interface between humans and technology. ams’ high-performance sensor solutions drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. Products include sensor solutions, sensor ICs, interfaces and related software for consumer, communications, industrial, medical, and automotive markets. With headquarters in Austria, ams employs about 9,000 people globally and serves more than 8,000 customers worldwide.

Leading manufacturers around the globe rely on ams’ sensing know-how for advanced systems design. For ams, “Sensing is Life” and our passion is in creating the sensor solutions that make devices smarter, safer, convenient and more environment-friendly. ams’ sensor solutions are at the heart of the products and technologies that define our world today –from smartphones and mobile devices to smart homes and buildings, industrial automation, medical technology, and connected vehicles. Our products drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. We offer sensors (including optical sensors), interfaces and related software for consumer, communications, industrial, medical, and automotive markets.

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Vincent Dicaprio

  • VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
  • Applied Materials

Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES.

Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions.

With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging.

For more information please visit: linkedin.com/in/vincentdicaprio

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Applied Materials

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

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Martin Weigert

  • VP & GM Industrial Fiber Products Division
  • Broadcom

Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber optic and sensor products targeting the industrial, automotive and medical market. Martin Weigert worked for Siemens/Osram/Infineon/Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Broadcom. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies GmbH in Munich, Avago Technologies Fiber Austria GmbH in Vienna and a member of the supervisory board at CISES (Chinese International Semiconductor Executive Summit).

20 years experience in Fiber Optics

1994 -1997 – Process development MEMS
1997 -1998 – Task force leader production ramp-up
1998 –1999 – Project leader optical SMD devices
1999 –2000 – Marketing Manager Automotive LED
2001 –2004 – Director Development Fiber Optics
2004 –2006 – Director Marketing POF
2006 –2007 – Director Product Line Manager (R&D+Marketing) at Infineon
Since 2008 – General Manager Industrial Fiber Optics at Avago Technologies
Since 2009 – Managing Director “Avago Technologies Fiber GmbH”
2011-2017 – Member of the supervisory board at MIC AG
Since 2012 – Managing Director “Avago Technologies Fiber Austria GmbH”
2014-2016 – Vice President & General Manager at Avago Technologies
Since 2016 – Vice President & General Manager at Broadcom

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Broadcom

Coming soon…

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Najwa Khazal

  • General Manager STC Americas
  • Edwards

Najwa Khazal has more than 20 years’ experience in the delivery of business transformation programs across a range of industries, including energy, aerospace and automotive, in America, China, EMEA, India and Mexico. Her successful track record in driving value creation programs spans supply chain management, product lifecycle management, process integration, digital transformation and organizational change.

Najwa joined Edwards as General Manager for the Service Technology Centres (STC) Americas organisation in April 2021, responsible for defining, implementing and facilitating the strategic initiatives needed to support the future growth of Edwards and its customers in the semiconductor industry. Najwa has responsibility for the operational performance and management of remanufacturing facilities located in Glenwillow and Hillsboro in the US, Nogales in Mexico, and Sao Paulo in Brazil.

Prior to joining Edwards, Najwa was General Manager for Collins Aerospace.

Najwa has a broad education, achieving a distinction from the Harvard Business Analytics Program, a Master of Business Administration and a Bachelor of Science in Mechanical Engineering Technology.

Najwa is a passionate advocate for STEM (science, technology, engineering, maths) education, and has spent more than a decade facilitating international business and organizational development classes for undergraduate and master level students.

Najwa is a US citizen and is based in Arizona.

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Edwards

Edwards is a global leader of vacuum and abatement. We are proud to lead the industry, pushing the boundaries of science to deliver innovative products which are intrinsic to everyday life, working in partnership with our customers, and continually setting new standards.

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Amy Leong

  • Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
  • Formfactor

Amy Leong has been with FormFactor since October 2012. Prior to this, Amy was the VP of Marketing at MicroProbe from April 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Ms. Leong worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the ASSP system-on-chip and microcontroller markets. From 2003 to 2008, Ms. Leong worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, Ms. Leong worked in a variety of semiconductor process engineering and product marketing roles at KLA-Tencor and IBM.

Ms. Leong holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.

 

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Formfactor

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.

FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems, quantum cryogenic systems, and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips.

Visit www.formfactor.com.

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Dr. Hamid Azimi

Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.

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Intel Corporation

Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Christine Dunbar

  • SVP Global Sales
  • IQE

Christine Dunbar is currently Senior Vice President of Global Sales at IQE, the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry. Christine joined IQE in August 2022.

Christine was previously at GlobalFoundries where she held various executive roles driving GF business growth towards the October 2022 IPO. She joined GlobalFoundries in July 2015 with the IBM Microlectronics Division acquisition, as the Vice President of Product Management for the RF Business Unit.

Christine graduated from Cornell University in 1996 with a bachelor’s degree in Materials Science and Engineering and has held various engineering, technical management, and executive positions throughout her career, including leadership roles in Sales, Business Development & Semiconductor Manufacturing Operations. In 2018 Christine was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award.

Christine is passionate about serving as an ambassador for her employers and the semiconductor industry writ large thru active participation and speaking engagements at various industry forums. Christine is also a passionate advocate for women in semiconductors, and has sponsored the establishment of women’s resource groups at IBM, GlobalFoundries and IQE.

Christine is also active in her community supporting causes important to her. She is a founding member of the Leadership Now Project, a group of non-partisan business leaders committed to the health of the US democracy, established in 2017. Christine also serves on the Board of Directors at the Boys and Girls Club of Burlington, Vermont. She lives in Shelburne, Vermont USA with her partner & two teenage children.

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IQE

IQE is the leading supplier of compound semiconductor wafer products and advanced material solutions to the global semiconductor industry that enable a diverse range of applications across mobile handsets, global telecoms infrastructure, smart connected devices, electric vehicles, infrared and sensing applications.

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Oreste Donzella

  • Executive VP – EPC (Electronics, Packaging, and Component) Group
  • KLA

Oreste Donzella serves as Executive Vice President of the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which include multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.

Previously, Oreste covered wide range of positions at KLA, including Chief Marketing Officer (CMO), Customer Engagement VP, General Managers of the Surfscan and SWIFT product divisions and various other technical and business roles. of KLA.

Oreste brings ~30 years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent more than six years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.

Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy.

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KLA

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com

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Thy Tran

Thy Tran, Vice President of DRAM Process Integration at Micron Technology, Inc. oversees a global team based in the US, Japan, and Taiwan to drive DRAM technology development and transfer into high-volume manufacturing fabs. She has 28 years of semiconductor experience working in the US, Europe, and Asia, including two fab startups.

Ms. Tran joined Micron in 2008 and led several DRAM Development programs before taking on the Process Integration node leadership role for several DRAM generations. Prior to Micron, Ms. Tran worked on Logic and SRAM technologies at Motorola and WaferTech, and DRAM technology at Siemens, which later spun off to Infineon and Qimonda. She graduated from the University of Washington with a Bachelor of Science in Electrical Engineering, and the Stanford Graduate School of Business’s Executive Program.

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Micron Technology, Inc.

Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Naveed Sherwani

Dr. Naveed Sherwani is a world renowned chip expert, researcher, author of several books, serial entrepreneur and academician. He is most well known as a serial entrepreneur and his story is about forming and building companies.

He graduated from NED university in Karachi, Pakistan, in 1983. After NED, he got PhD from university of Nebraska-Lincoln in computer engineering in 1988. And served as a professor at Western Michigan University for six years before joining Intel in 1994. At Intel his worked was focused on design automation of some of the complex chips of that era. He left intel in 2003 and subsequently dedicated his career to entrepreneurship.

He started early and his first company at 18 years of age in Karachi, while he was student at NED, called simply The Coaching Center, went on to become a Technical training college with 225 students and 11 employees within three years. He went on to found several companies including: CSTI, Intel Micro-electronics, Open-Silicon, Brite semiconductors, Anasage, HighSilicon, HighBitCoin, PeerNova, StarFive. LeapFive, ChinaFive, SemiFive, Lampro Mellon, Global Semiconductor Group, GS Microelectronics and Rapid silicon.

He founded Intel Microelectronics Services, in 1999, raising funding from intel capital, where he pioneered Open methodology for EDA.

Later on he founded Open Silicon in 2003 and raised funding from leading VCs including Sequoia, Norwest and Interwest. It went to become a leader in chip Design services and sold it to PE in 2008.

He then founded Brite Semiconductor in China, in 2008, a leading solution provider in China / APAC where money was raised from leading VCs in China including Gobi ventures. It was sold to SMIC in 2012.

Subsequently in 2013, He started three companies: Anasage, an enterprise sales analytics company, Hisilicon, a Serdes Company and PeerNova, a blockchain based financial services company. In 2016, he raised funding for PeerNova from leading VCs include IVP, mosaic ventures among others.

For SiFive, he raised multiple rounds of funding from leading VCs including, Sutterhill, Osage, Spark, and strategics including Intel, Samsung, Hynix, Western Digital, and Xiomen. SiFive become a tech unicorn.

During 2018-2019, he has cofounded four new RISC-V related companies in China, Korea and Pakistan: StarFive, LeapFive and ChinaFive in China, SemiFive in South Korea, and Lampro Mellon in Lahore, Pakistan.

More recently, he has founded Global Semiconductor Group , GS Microelectronics (an OSAT company) and Rapid silicon ( a FPGA company).

Earlier in his career, as a researcher and academic, his area of Research include VLSI, EDA, combinatorics, graph theory and parallel computation. He published several books including the text book on chip Design called “Algorithms for VLSI Physicsl Design Automation”. This book is a standard textbook in graduate classes in most leading universities in the world. He also published over 125 refereed Technical articles in leading publications, and conferences, several of them have received best paper awards.

He also graduated several masters and PhD students over the years. Many of his students, went on to become famous on their Accord, and have gone to found many companies and serve in major international companies.

For his services for Pakistan, Dr. Naveed Sherwani was awarded Sitara-e-Quaidazam in 2019, by President Arif Alvi.

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OSFPGA Foundation

The Open Source FPGA Foundation is a 501(c)(6) non-profit organization with a vision and mission of accelerating the worldwide awareness and widespread adoption of FPGA technology as an integral component of semiconductors in the Autonomous & Ubiquitous Intelligence Age through the proliferation of open-source FPGA and eFPGA fabrics and associated tooling, to lower the barriers of entry.

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Rapid Silicon

Rapid Silicon brings creativity to FPGA design by combining the open-source FPGA methodology with proprietary technologies that enable a faster design to silicon turnaround. In addition, our innovative AI-enhanced EDA tools provide the most optimized design result than the traditional approach which satisfies the needs in general-purpose or domain-specific applications.

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Robert Ferguson

Bob Ferguson is President and CEO of Schmid Systems Inc., part of the Schmid Group based Freudenstadt, Germany. He oversees US operations and drives growth for the company’s manufacturing solutions in the Electronics, Photovoltaics, Energy Systems and Customer Service markets.

A seasoned executive with a distinguished 30-year track record in the specialty chemicals and electronic materials sectors, Bob’s combined corporate and consulting expertise includes strategic planning, sales and marketing excellence, M&A due diligence and integration, Asia sourcing strategies and human capital.

Bob previously served as Executive Vice President Electronic Materials & Asia, Avantor Performance Materials where led the turn-around of the semiconductor business. Prior to this appointment and China-based, he was Corporate Vice President, Asia Development at Veeco Instruments and Corporate Vice President, Electronic Materials, and Global Business Unit Director at Dow Chemicals.

Bob is a prior Board Member and former Chair for IPC International (www.ipc.org), an electronics standards and trade association, as well as the founder of boutique consultancy, BreakFree Strategies. Additionally, he served as a Board Member and Chair of Nichigo Morton, a Japanese based joint venture between Rohm and Haas (now Dow Chemicals) and Nippon Gosai.

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Schmid Systems Inc.

Part of the Schmid Group based Freudenstadt, Germany.

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Jason Zee

  • Global Vice President, General Manager of the Storage and System Level Test Group at Teradyne, China Managing Director
  • Teradyne

Jason Zee is an experienced Group General Manager with a demonstrated history of working in the semiconductors and robotic automation industry. He has over 30+ years of experience in the Semiconductor Test industry. In his 30+ years in the business, he has served in a variety of roles in product management, marketing, engineering, senior management in multiple countries and managing multi-million P&L businesses. His current role is the Vice President and General Manager of the Storage and System Level Test Group at Teradyne. Mr. Zee is also fluent in multiple languages including English, Mandarin and Cantonese that serves him well in this global business.

Mr. Zee earned a Bachelor’s degree in Electrical Engineering from Worcester Polytechnic Institute in Worcester, Massachusetts and his Master’s Degree in Engineering from Cornell University in Ithaca, New York.

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Teradyne

Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.

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+1 978-370-2700
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