Hamid Azimi photo

Chairman: Dr. Hamid Azimi

Corporate VP, Director of Substrate Packaging TD

Intel

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Markus Keil photo

Deputy Chairman: Markus Keil

VP Global Semiconductor Operations/COO

Nextlens

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Sonny Banwari photo

Sunil Banwari

VP Business Development, Advantest Cloud Solutions (ACS)

Advantest

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Curtis Zwenger photo

Curtis Zwenger

VP Advanced SiP Product Development

Amkor Technology, Inc.

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Jennifer Zhao photo

Jennifer Zhao

GM & EVP for Advanced Optical Sensors Division

ams

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Vincent Dicaprio photo

Vincent DiCaprio

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development

Applied Materials

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CJ Hsieh

CJ Hsieh

COO

Aspeed Technology

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Wei Wang photo

Wei Wang

Assistant President; Director of Strategy Development

Automotive Research Institute (Suzhou), Tsinghua University (TSARI)

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Xiaoxin Qiu

Dr. Xiaoxin Qiu

CEO

Axera Technology Co., Ltd

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Ralf Bornefeld photo

Ralf Bornefeld

SVP, Power Semiconductors & Modules

Bosch

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Martin Weigert photo

Martin Weigert

VP & GM Induatrial Fiber Products Division

Broadcom

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Yuan Yuan Zhou

Dr. Yuan Yuan Zhou

Global Business Director

DuPont Electronics & Industrial

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Najwa Khazal photo

Najwa Khazal

General Manager, STC Americas

Edwards Vacuum

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Alex Lidow photo

Dr. Alex Lidow

CEO and Co-Founder

EPC

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Amy Leong photo

Amy Leong

CMO

FormFactor

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Dr. Qingchun Zhang photo

Dr. Qingchun Zhang

Professor

Fudan University

Fudan University
Andy Chuang photo

Andy Chuang

VP Business Development

GaN Systems

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Jim Witham photo

Jim Witham

CEO

GaN Systems

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Farhat Jahangir photo

Farhat Jahangir

Co-founder & CEO

GS Microelectronics

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Vance Wang photo

Vance Wang

Formerly VP New Fab Project at GTA

Company TBC

Dr. Yongxiang Wen photo

Dr. Yongxiang Wen

Process Technology Director

Hangzhou Silan Microelectronics Co Ltd

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Rainer Kaesmaier photo

Dr. Rainer Kaesmaier

Managing Director, Semiconductors

Hitachi Energy

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Chang Fu photo

Chang Fu

Advanced Module R&D Dep., Deputy Director

HLMC

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Prof. Shaojun Wei

Prof. Shaojun Wei

Professor

IME, Tsinghua University

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Denis Marcon photo

Denis Marcon

General Manager

Innoscience Europe

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Prof. Tianchun Ye photo

Prof. Tianchun Ye

Researcher Professor / Secretary General

Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance

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Yaojian Lin photo

Yaojian Lin

VP, GM of Technology R&D Center

JCET Group

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Oreste Donzella photo

Oreste Donzella

EVP Electronics, Packaging and Components (EPC) Group

KLA Corporation

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Ian Hsu

Ian Hsu

Director, IC Packaging Technology Development

Mediatek

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Dr. Akshay Singh photo

Dr. Akshay Singh

VP, Advanced Packaging Technology Development

Micron

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Thy Tran photo

Thy Tran

VP DRAM Process Integration

Micron

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JY Zhang photo

JY Zhang

Chairman and CEO

MooreElite

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Marco Giandalia photo

Marco Giandalia

VP IC Design

Navitas Semiconductor

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Carlos Castro photo

Carlos Castro

VP & GM Power GaN FETs

Nexperia

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Jian Zhang photo

Jian Zhang

VP Product Test Engineering

Qualcomm

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Edward Wei photo

Edward Wei

Senior Adviser to President

Realtek Semiconductor Corp

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Santosh Kumar photo

Santosh Kumar

VP & Head, Semiconductor Manufacturing

Reliance Industries Ltd

Dr. Avi Kashyap photo

Dr. Avinash Kashyap

VP Automotive BU

Renesas Electronics

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Tim Yeh photo

Dr. Tim Yeh

Director of GaN Power Device Technology Development

Sanan Optoelectronics

Sanan Optoelectronics
Eric Lee photo

Eric Lee

President of Sales Group

Scientech

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Christophe Maleville photo

Christophe Maleville

CTO Senior, EVP Innovation

Soitec

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Dr. Yu-Po Wang photo

Dr. Yu-Po Wang

VP Corporate R&D Center

SPIL

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Edoardo Merli photo

Edoardo Merli

EVP, Power Transistor Sub-Group Automotive and Discrete Group

STMicroelectronics

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Andrew Peng

Andrew Peng

Formerly VP of Spin Transfer

In Transition

Joseph Chou photo

Joseph Chou

GM

Suzhou Semitop Semiconductor

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Jason Zee photo

Jason Zee

Global Vice President, General Manager of the Storage and System Level Test Group

Teradyne, Inc.

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Dr Key Chung photo

Dr. Key Chung

Advanced Packaging CTO

TongFu Microelectronics Co., Ltd

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