
Advisory Board
Agnes Jahnke
Agnes Jahnke is responsible for the Product Marketing for Silicon Carbide (SiC) and Gallium Nitride (GaN) at X-FAB, the leading analog/mixed-signal and MEMS foundry group manufacturing wafers for automotive, industrial, consumer, medical and other markets.
Agnes joined X-FAB in early 2019, starting as Product Marketing Manager Automotive. She then quickly focused on the Marketing of X-FAB’s wide bandgap offering, being responsible for the 6” (200 mm) Silicon Carbide and 8” GaN-on-Si technologies. She holds responsibilities of strategic development, product roadmap and portfolio management, business development and branding of X-FAB’s wide bandgap portfolio. Prior to this role, Agnes held various Product Marketing and Product Management positions within companies of the solar industry.

X-FAB
X-FAB is the leading analog/mixed-signal and specialty foundry group manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS and SOI processes in geometries ranging from 1.0 µm to 130 nm, and its special micro-electro-mechanical systems (MEMS) processes. X-FAB is also the first pure-play foundry to provide comprehensive processing technologies for the wide-bandgap materials silicon carbide (SiC) and gallium nitride (GaN). The GaN-on-Si wafers are manufactured in its modern 8” fab in Dresden, Germany, and SiC wafers in the 6” fab in Lubbock, Texas, USA. X-FAB runs six production facilities in Germany, France, Malaysia and the U.S. The company employs about 4,000 people worldwide.
Phone: +49 361 427 6170
E-mail:
Website: www.xfab.com
More Advisory Board Members
Chairman: Dr. Hamid Azimi
Intel
Deputy Chairman: Markus Keil
Nextlens
Sunil Banwari
Advantest
Dr. Xiaoning Qi
Alibaba Group
Curtis Zwenger
Amkor Technology, Inc.
Jennifer Zhao
ams
Vincent DiCaprio
Applied Materials
Bernard Lim
Appscard Groups AS
CJ Hsieh
Aspeed Technology
Wei Wang
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
Axera Technology Co., Ltd
Dr. Marnix Tack
BelGaN
Ralf Bornefeld
Bosch
Arjun Kantimahanti
Broadcom
Martin Weigert
Broadcom
Dr. Yuan Yuan Zhou
DuPont Electronics & Industrial
Najwa Khazal
Edwards Vacuum
Dr. Alex Lidow
EPC
Amy Leong
FormFactor
Dr. Qingchun Zhang
Fudan University
Andy Chuang
GaN Systems
Jim Witham
GaN Systems
J Philip Vincent
GSH
Farhat Jahangir
GS Microelectronics
Vance Wang
Company TBC
Dr. Yongxiang Wen
Hangzhou Silan Microelectronics Co Ltd
Dr. Rainer Kaesmaier
Hitachi Energy
Chang Fu
HLMC
Prof. Shaojun Wei
IME, Tsinghua University
Noorazidi Che Azib
Inari Technology
Denis Marcon
Innoscience Europe
AK Chong
Intel Malaysia
Prof. Tianchun Ye
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Dato’ Seri Lee Kah Choon
Invest Penang
Ray Yang
ITRI
Yaojian Lin
JCET Group
Oreste Donzella
KLA Corporation
Ian Hsu
Mediatek
Dr. Akshay Singh
Micron
Thy Tran
Micron
JY Zhang
MooreElite
Marco Giandalia
Navitas Semiconductor
Carlos Castro
Nexperia
Jian Zhang
Qualcomm
Edward Wei
Realtek Semiconductor Corp
Santosh Kumar
Reliance Industries Ltd
Dr. Avinash Kashyap
Renesas Electronics
Tomomitsu Maoka
Resonac
Dr. Tim Yeh
Sanan Optoelectronics