
Advisory Board
Dr. Key Chung
C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.

TongFu Microelectronics Co., Ltd
Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000.
As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people.
Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers.
The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise.
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Intel
Deputy Chairman: Markus Keil
Nextlens
Sunil Banwari
Advantest
Dr. Xiaoning Qi
Alibaba Group
Curtis Zwenger
Amkor Technology, Inc.
Jennifer Zhao
ams
Vincent DiCaprio
Applied Materials
Bernard Lim
Appscard Groups AS
CJ Hsieh
Aspeed Technology
Wei Wang
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
Axera Technology Co., Ltd
Dr. Marnix Tack
BelGaN
Ralf Bornefeld
Bosch
Martin Weigert
Broadcom
Dr. Yuan Yuan Zhou
DuPont Electronics & Industrial
Najwa Khazal
Edwards Vacuum
Dr. Alex Lidow
EPC
Amy Leong
FormFactor
Dr. Qingchun Zhang
Fudan University
Andy Chuang
GaN Systems
Jim Witham
GaN Systems
J Philip Vincent
GSH
Farhat Jahangir
GS Microelectronics
Vance Wang
Company TBC
Dr. Yongxiang Wen
Hangzhou Silan Microelectronics Co Ltd
Dr. Rainer Kaesmaier
Hitachi Energy
Chang Fu
HLMC
Prof. Shaojun Wei
IME, Tsinghua University
Noorazidi Che Azib
Inari Technology
Denis Marcon
Innoscience Europe
AK Chong
Intel Malaysia
Prof. Tianchun Ye
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Dato’ Seri Lee Kah Choon
Invest Penang
Ray Yang
ITRI
Yaojian Lin
JCET Group
Oreste Donzella
KLA Corporation
Ian Hsu
Mediatek
Dr. Akshay Singh
Micron
Thy Tran
Micron
JY Zhang
MooreElite
Marco Giandalia
Navitas Semiconductor
Carlos Castro
Nexperia
Jian Zhang
Qualcomm
Edward Wei
Realtek Semiconductor Corp
Santosh Kumar
Reliance Industries Ltd
Dr. Avinash Kashyap
Renesas Electronics
Dr. Tim Yeh
Sanan Optoelectronics
Eric Lee
Scientech
Samuel Liu
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