Chairman: Dr. Hamid Azimi
Intel
C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.
Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000.
As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people.
Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers.
The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise.
Our global events and conferences for the semiconductor and MEMS & Sensors manufacturing and supply industry, bring together political, business, financial, research and industry leaders and decision makers all under one roof.
ISES China offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES Middle East in Oman offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES Power in Europe offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES SEA in Southeast Asia offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
More details coming soon…
ISES Taiwan offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES USA in Arizona offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
MWS in China offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Europe (EU) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Southeast Asia (SEA) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
Our event exhibitors, sponsors and delegates are from across the worlds of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
Our webinars provide opportunities for political, business, financial, research and industry decision makers to uncover deep, expert insights into the Semiconductor, MEMS & Sensors industries remotely, without any need to travel.
April 13, 2022 | ISES Webinar: 5G and IoT
January 26, 2022 | ISES Webinar: Market Research
May 18, 2022 | MWS Webinar: Research Institutes
March 29, 2022 | MWS Webinar: Titans
January 27, 2022 | MWS Webinar: Market Research & Startups
February 26, 2021 | ISES Market Research webinar
March 30, 2021 | ISES Memory Manufacturing webinar
May 6, 2021 | ISES Advanced Packaging webinar
May 12, 2021 | ISES Supply Chain webinar
May 28, 2021 | ISES Power Semiconductors & Automotive Electronics webinar
June 25, 2021 | ISES AI Chip webinar
July 19, 2021 | ISES 5G and IoT webinar
September 16, 2021 | ISES CMOS Image Sensors webinar
March 9, 2021 | MWS MEMS Startups webinar
April 12, 2021 | MWS MEMS Titans Update webinar
May 25, 2021 | MWS Research Institute Update webinar
Our event and webinar sponsors feature leading companies from across the semiconductor and MEMS & Sensors industries, including designers and manufacturers of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
We attract senior government officials, research institutes, investors and their industry counterparts from around the world.
We carefully profile all delegates pre-registration to ensure an audience of exclusive members looking for new solution providers.
We’re committed to advancing future semiconductor and MEMS manufacturing by driving innovation, business and investment opportunities.
For OSATS | Foundries | IC Design Houses | End Users
1 complimentary VIP pass to ALL ISES 2023 in-person events for a C/VP/Director Level executive from one of the following departments at your company:
All additional event passes will be registered at the lower member rate.
An example of membership cost savings when registering an ISES event pass:
For Equipment | Materials | EDA | Software Suppliers
Please contact us for supplier sponsorship opportunities via our Sponsorship Form