Chairman: Dr. Hamid Azimi
Intel
Dr. Wei Li graduated in 1994 from the Department of Mechanical Engineering, Tsinghua University and received his Master’s Degree of Materials Engineering in 1997 from Zhejiang University, followed by his Ph.D in 2000 from the Microelectronics at Shanghai Institute of Metallurgy CAS.
Dr. Li participated in the establishment of Simgui and has served many roles in that company since 2001, including: Assistant to the President; Vice President; and Secretary of the Board. Since 2017, Dr. Li has been the Chairman of Simgui.
Dr. Li assisted in the launch of Zing Semiconductor in 2014, and has also served multiple roles there, including: Board Member, Co-CEO and Legal Representative. From May 2019, he has been the Chairman of Zing Semiconductor.
Dr. Li also helped to initiate the founding of NSIG and served as EVP of the company. From 2017, he continues in his role as the Secretary of the Board of Directors.
Dr. Li was awarded the 1st Class Reward of National Technology Improvements, First Prize of Shanghai Science and Technology Progress Award, and Outstanding Scientific Achievement Reward. He was selected as Shanghai Model Worker and to the National Ten Thousand Talent Program in 2016. Dr. Li has been responsible for many national / local scientific research and industrialization projects.
Dr. Li also serves as Vice President of China Semiconductor Industry Association (CSIA) as well as Vice President of IC MTIA.
1994年李炜博士毕业于清华大学机械工程系,1997年获浙江大学材料工程硕士学位,2000年获中国科学院上海冶金所微电子学博士学位。
李炜博士于2001年参与发起创立上海新傲科技股份有限公司,历任总经理助理、副总经理,兼任董事会秘书。2017年3月起担任新傲科技董事长。
2014年协助发起创立上海新昇半导体科技有限公司,历任董事、联席CEO兼法定代表人。2019年5月起担任上海新昇董事长。
2015年12月参与发起设立上海硅产业集团股份有限公司,任硅产业集团执行副总裁,2017年起兼任董事会秘书。
李炜博士荣获国家科技进步一等奖、上海市科学技术进步一等奖、中国科学院杰出科技成就奖等,2010年被评为上海市劳动模范,并于2016年入选中组部第二批国家“万人计划”。李炜博士曾主持或参与了包括02专项在内的多项国家或上海市重大科研或产业化项目。
李炜博士担任中国集成电路行业协会支撑业分会副理事长,中国集成电路材料产业技术创新联盟副理事长。
Profile coming soon…
Our global events and conferences for the semiconductor and MEMS & Sensors manufacturing and supply industry, bring together political, business, financial, research and industry leaders and decision makers all under one roof.
ISES China offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES Middle East in Oman offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES Power in Europe offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES SEA in Southeast Asia offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
More details coming soon…
ISES Taiwan offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES USA in Arizona offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
MWS in China offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Europe (EU) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Southeast Asia (SEA) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
Our event exhibitors, sponsors and delegates are from across the worlds of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
Our webinars provide opportunities for political, business, financial, research and industry decision makers to uncover deep, expert insights into the Semiconductor, MEMS & Sensors industries remotely, without any need to travel.
April 13, 2022 | ISES Webinar: 5G and IoT
January 26, 2022 | ISES Webinar: Market Research
May 18, 2022 | MWS Webinar: Research Institutes
March 29, 2022 | MWS Webinar: Titans
January 27, 2022 | MWS Webinar: Market Research & Startups
February 26, 2021 | ISES Market Research webinar
March 30, 2021 | ISES Memory Manufacturing webinar
May 6, 2021 | ISES Advanced Packaging webinar
May 12, 2021 | ISES Supply Chain webinar
May 28, 2021 | ISES Power Semiconductors & Automotive Electronics webinar
June 25, 2021 | ISES AI Chip webinar
July 19, 2021 | ISES 5G and IoT webinar
September 16, 2021 | ISES CMOS Image Sensors webinar
March 9, 2021 | MWS MEMS Startups webinar
April 12, 2021 | MWS MEMS Titans Update webinar
May 25, 2021 | MWS Research Institute Update webinar
Our event and webinar sponsors feature leading companies from across the semiconductor and MEMS & Sensors industries, including designers and manufacturers of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
We attract senior government officials, research institutes, investors and their industry counterparts from around the world.
We carefully profile all delegates pre-registration to ensure an audience of exclusive members looking for new solution providers.
We’re committed to advancing future semiconductor and MEMS manufacturing by driving innovation, business and investment opportunities.
For EDA | Design Services | OSATS | Foundries | IC Design Houses | End Users
Memberships are based on calendar year. It commences 1st January 2023 and ends on 31st December 2023.
All additional event passes will be registered at the lower member rate.
An example of membership cost savings when registering an ISES USA event pass:
For Equipment | Materials | EDA | Software Suppliers
Please contact us for supplier sponsorship opportunities via our Sponsorship Form