Corporate VP, Director of Substrate Packaging TD
Intel
Advisory Board
J Philip Vincent
Coming soon…
GSH
Profile coming soon…
More Advisory Board Members
Deputy Chairman: Markus Keil
VP Global Semiconductor Operations/COO
Nextlens
Nextlens
Sunil Banwari
VP Business Development, Advantest Cloud Solutions (ACS)
Advantest
Advantest
Dr. Xiaoning Qi
CEO
Alibaba Group
Alibaba Group
Curtis Zwenger
VP Advanced SiP Product Development
Amkor Technology, Inc.
Amkor Technology, Inc.
Jennifer Zhao
GM & EVP for Advanced Optical Sensors Division
ams
ams
Vincent DiCaprio
VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
Applied Materials
Applied Materials
Bernard Lim
Vice President Operations
Appscard Groups AS
Appscard Groups AS
CJ Hsieh
COO
Aspeed Technology
Aspeed Technology
Wei Wang
Assistant President; Director of Strategy Development
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
CEO
Axera Technology Co., Ltd
Axera Technology Co., Ltd
Ralf Bornefeld
SVP, Power Semiconductors & Modules
Bosch
Bosch
Martin Weigert
VP & GM Induatrial Fiber Products Division
Broadcom
Broadcom
Dr. Yuan Yuan Zhou
Global Business Director
DuPont Electronics & Industrial
DuPont Electronics & Industrial
Najwa Khazal
General Manager, STC Americas
Edwards Vacuum
Edwards Vacuum
Dr. Alex Lidow
CEO and Co-Founder
EPC
EPC
Amy Leong
CMO
FormFactor
FormFactor
Dr. Qingchun Zhang
Professor
Fudan University
Fudan University
Andy Chuang
VP Business Development
GaN Systems
GaN Systems
Jim Witham
CEO
GaN Systems
GaN Systems
Farhat Jahangir
Co-founder & CEO
GS Microelectronics
GS Microelectronics
Vance Wang
Formerly VP New Fab Project at GTA
Company TBC
Company TBC
Dr. Yongxiang Wen
Process Technology Director
Hangzhou Silan Microelectronics Co Ltd
Hangzhou Silan Microelectronics Co Ltd
Dr. Rainer Kaesmaier
Managing Director, Semiconductors
Hitachi Energy
Hitachi Energy
Chang Fu
Advanced Module R&D Dep., Deputy Director
HLMC
HLMC
Prof. Shaojun Wei
Professor
IME, Tsinghua University
IME, Tsinghua University
Noorazidi Che Azib
Deputy Vice President
Inari Technology
Inari Technology
Denis Marcon
General Manager
Innoscience Europe
Innoscience Europe
AK Chong
Vice President, Manufacturing, Supply Chain and Operations Managing Director
Intel Malaysia
Intel Malaysia
Prof. Tianchun Ye
Researcher Professor / Secretary General
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Dato’ Seri Lee Kah Choon
Special Investment Advisor to the Rt. Hon Chief Minister of Penang, Malaysia
Invest Penang
Invest Penang
Yaojian Lin
VP, GM of Technology R&D Center
JCET Group
JCET Group
Oreste Donzella
EVP Electronics, Packaging and Components (EPC) Group
KLA Corporation
KLA Corporation
Ian Hsu
Director, IC Packaging Technology Development
Mediatek
Mediatek
Dr. Akshay Singh
VP, Advanced Packaging Technology Development
Micron
Micron
Thy Tran
VP DRAM Process Integration
Micron
Micron
JY Zhang
Chairman and CEO
MooreElite
MooreElite
Marco Giandalia
VP IC Design
Navitas Semiconductor
Navitas Semiconductor
Carlos Castro
VP & GM Power GaN FETs
Nexperia
Nexperia
Jian Zhang
VP Product Test Engineering
Qualcomm
Qualcomm
Edward Wei
Senior Adviser to President
Realtek Semiconductor Corp
Realtek Semiconductor Corp
Santosh Kumar
VP & Head, Semiconductor Manufacturing
Reliance Industries Ltd
Reliance Industries Ltd
Dr. Avinash Kashyap
VP Automotive BU
Renesas Electronics
Renesas Electronics
Dr. Tim Yeh
Director of GaN Power Device Technology Development
Sanan Optoelectronics
Sanan Optoelectronics
Eric Lee
President of Sales Group
Scientech
Scientech
Samuel Liu
VP
Skymizer
Skymizer
Christophe Maleville
CTO Senior, EVP Innovation
Soitec
Soitec
Dr. Yu-Po Wang
VP Corporate R&D Center
SPIL
SPIL
Edoardo Merli
EVP, Power Transistor Sub-Group Automotive and Discrete Group
STMicroelectronics
STMicroelectronics
