Chairman: Dr. Hamid Azimi
Intel
Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier this year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.
Our global events and conferences for the semiconductor and MEMS & Sensors manufacturing and supply industry, bring together political, business, financial, research and industry leaders and decision makers all under one roof.
ISES China offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES Middle East in Oman offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES Power in Europe offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES SEA in Southeast Asia offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
More details coming soon…
ISES Taiwan offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES USA in Arizona offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
MWS in China offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Europe (EU) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MWS in Southeast Asia (SEA) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
Our event exhibitors, sponsors and delegates are from across the worlds of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
Our webinars provide opportunities for political, business, financial, research and industry decision makers to uncover deep, expert insights into the Semiconductor, MEMS & Sensors industries remotely, without any need to travel.
April 13, 2022 | ISES Webinar: 5G and IoT
January 26, 2022 | ISES Webinar: Market Research
May 18, 2022 | MWS Webinar: Research Institutes
March 29, 2022 | MWS Webinar: Titans
January 27, 2022 | MWS Webinar: Market Research & Startups
February 26, 2021 | ISES Market Research webinar
March 30, 2021 | ISES Memory Manufacturing webinar
May 6, 2021 | ISES Advanced Packaging webinar
May 12, 2021 | ISES Supply Chain webinar
May 28, 2021 | ISES Power Semiconductors & Automotive Electronics webinar
June 25, 2021 | ISES AI Chip webinar
July 19, 2021 | ISES 5G and IoT webinar
September 16, 2021 | ISES CMOS Image Sensors webinar
March 9, 2021 | MWS MEMS Startups webinar
April 12, 2021 | MWS MEMS Titans Update webinar
May 25, 2021 | MWS Research Institute Update webinar
Our event and webinar sponsors feature leading companies from across the semiconductor and MEMS & Sensors industries, including designers and manufacturers of power semiconductors, Micro Electronic Mechanical Systems, advanced and 3D packaging, 5G, IoT, IC design, AI chips, 3dsoc, plasma dicing, automotive electronics and more.
We attract senior government officials, research institutes, investors and their industry counterparts from around the world.
We carefully profile all delegates pre-registration to ensure an audience of exclusive members looking for new solution providers.
We’re committed to advancing future semiconductor and MEMS manufacturing by driving innovation, business and investment opportunities.
For OSATS | Foundries | IC Design Houses | End Users
Memberships are based on calendar year. It commences 1st January 2023 and ends on 31st December 2023.
All additional event passes will be registered at the lower member rate.
An example of membership cost savings when registering an ISES USA event pass:
For Equipment | Materials | EDA | Software Suppliers
Please contact us for supplier sponsorship opportunities via our Sponsorship Form