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Oreste Donzella photo
Advisory Board

Oreste Donzella

  • KLA Corporation
  • EVP Electronics, Packaging and Components (EPC) Group
  • Biography

Oreste Donzella serves as Executive Vice President of Electronics, Packaging and Components.

In over 20 years at KLA, he has held leadership roles in the field of customer engagement, process control solutions, application development, strategic marketing and product development. Before joining KLA, Mr. Donzella worked at Texas Instruments and Micron, where he held various engineering and management positions in process integration and yield enhancement.

Mr. Donzella currently serves as a member of the SEMI North American Advisory Board.

Mr. Donzella earned his bachelor’s degree and master’s degree in electrical engineering from the Sapienza University of Rome.

KLA logo
  • Company Profile

KLA Corporation

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com

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