
Advisory Board
Vincent DiCaprio
Experienced in all facets of the technology sector, Vincent has over 30 years of outstanding achievement in Technology Development, Operations, Business, Sales and Marketing, having demonstrated success at companies like IBM, Amkor, ASE, TSMC, and GLOBALFOUNDRIES.
Currently leading Corporate and Business Development for the Advanced Packaging and ICAPS division at Applied Materials, he is responsible for forging new strategic alliances and partnerships key to technology advancement for future product solutions. Vincent leads all aspects of critical technology inflections related to Heterogenous Integrated, next generation integration of Silicon, volumetric scaling for all key aspects of the technology stack related to system level solutions.
With a degree in Pure and Applied sciences at Champlain Regional College, and a Bachelor of Engineering degree from Concordia University, Vincent is both the author and co-author of 30+ Patents in the field of advanced semiconductor packaging.
For more information please visit: linkedin.com/in/vincentdicaprio

Applied Materials
Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. Our innovations make possibleâ„¢ the technology shaping the future.
More Advisory Board Members
Chairman: Dr. Hamid Azimi
Intel
Deputy Chairman: Markus Keil
Nextlens
Dr. Marvin Liao
Dato’ Seri Lee Kah Choon
Aemulus
Dr. Xiaoning Qi
Alibaba Group
Curtis Zwenger
Amkor Technology, Inc.
Jennifer Zhao
ams
Bernard Lim
Appscard Groups AS
CJ Hsieh
Aspeed Technology
Wei Wang
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
Axera Technology Co., Ltd
Dr. Marnix Tack
BelGaN
Ralf Bornefeld
Bosch
Arjun Kantimahanti
Broadcom
Martin Weigert
Broadcom
Dr. Yuan Yuan Zhou
DuPont Electronics & Industrial
Najwa Khazal
Edwards Vacuum
Dr. Alex Lidow
EPC
Amy Leong
FormFactor
Dr. Qingchun Zhang
Fudan University
Andy Chuang
GaN Systems
Jim Witham
GaN Systems
J Philip Vincent
GSH
Farhat Jahangir
GS Microelectronics
Dr. Yongxiang Wen
Hangzhou Silan Microelectronics Co Ltd
Dr. Rainer Kaesmaier
Hitachi Energy
Chang Fu
HLMC
Prof. Shaojun Wei
IME, Tsinghua University
Noorazidi Che Azib
Inari Technology
Denis Marcon
Innoscience Europe
AK Chong
Intel Malaysia
Prof. Tianchun Ye
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Dr. Wei-Chung Lo
ITRI
Ray Yang
ITRI
Yaojian Lin
JCET Group
Oreste Donzella
KLA Corporation
Ian Hsu
Mediatek
Dr. Akshay Singh
Micron
Thy Tran
Micron
JY Zhang
MooreElite
Marco Giandalia
Navitas Semiconductor
Carlos Castro
Nexperia
Jian Zhang
Qualcomm
Edward Wei
Realtek Semiconductor Corp
Santosh Kumar
Reliance Industries Ltd
Dr. Avinash Kashyap
Renesas Electronics
Tomomitsu Maoka
Resonac
Dr. Tim Yeh
Sanan Optoelectronics
Eric Lee
Scientech