- Ph.D. Chemistry, 2001, National Taiwan University
- 2012~2021, Vice President, Unimicron Technology Corp.
– Advanced substrate, panel level RDL and glass substrate Technology
- 2001~2012, Deputy R&D Director. ITRI/EOSL
– 3DIC, wafer level stacked & 8” and 12” CIS TSV package technology
– Chip embedded in rigid and flexible substrate technology
– Flexible LED lighting package technology
Profile coming soon…