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Chairman: Dr. Hamid Azimi

Corporate Vice President, Intel Director, Substrate Packaging Technology Development


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Markus Keil photo

Deputy Chairman: Markus Keil

VP Global Semiconductor Operations/COO


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Xiaoning Qi photo

Dr. Xiaoning Qi


Alibaba Group

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Jennifer Zhao photo

Jennifer Zhao

GM & EVP for Advanced Optical Sensors Division


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Vincent Dicaprio photo

Vincent DiCaprio

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development

Applied Materials

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Wei Wang

Assistant President; Director of Strategy Development

Automotive Research Institute (Suzhou), Tsinghua University (TSARI)

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Xiaoxin Qiu

Dr. Xiaoxin Qiu


Axera Technology Co., Ltd

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Amy Leong



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Dr. Qingchun Zhang photo

Dr. Qingchun Zhang


Fudan University

Fudan University
Farhat Jahangir photo

Farhat Jahangir

Co-founder & CEO

GS Microelectronics

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Dr. Yongxiang Wen photo

Dr. Yongxiang Wen

Process Technology Director

Hangzhou Silan Microelectronics Co Ltd

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Chang Fu photo

Chang Fu

Advanced Module R&D Dep., Deputy Director


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Prof. Shaojun Wei

Prof. Shaojun Wei


IME, Tsinghua University

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Prof. Tianchun Ye

Researcher Professor / Secretary General

Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance

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Yaojian Lin

VP, GM of Technology R&D Center

JCET Group

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JY Zhang

Chairman and CEO


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Santosh Kumar

VP & Head, Semiconductor Manufacturing

Reliance Industries Ltd

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Dr. Tim Yeh

Director of GaN Power Device Technology Development

Sanan Optoelectronics

Sanan Optoelectronics
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Eric Lee

President of Sales Group


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Dr. Key Chung

Advanced Packaging CTO

TongFu Microelectronics Co., Ltd

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