Hamid Azimi photo

Chairman: Dr. Hamid Azimi

Corporate VP, Director of Substrate Packaging TD

Intel

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Sonny Banwari photo

Sunil Banwari

VP Business Development, Advantest Cloud Solutions (ACS)

Advantest

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Curtis Zwenger photo

Curtis Zwenger

VP Advanced SiP Product Development

Amkor Technology, Inc.

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Jennifer Zhao

GM & EVP for Advanced Optical Sensors Division

ams

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Vincent Dicaprio photo

Vincent DiCaprio

VP Advanced Packaging and ICAPS / Head of Business and Corporate Development

Applied Materials

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Martin Weigert photo

Martin Weigert

VP & GM Induatrial Fiber Products Division

Broadcom

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Najwa Khazal photo

Najwa Khazal

General Manager, STC Americas

Edwards Vacuum

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Amy Leong photo

Amy Leong

CMO

FormFactor

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Farhat Jahangir photo

Farhat Jahangir

Co-founder & CEO

GS Microelectronics

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Oreste Donzella photo

Oreste Donzella

EVP Electronics, Packaging and Components (EPC) Group

KLA Corporation

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Thy Tran photo

Thy Tran

VP DRAM Process Integration

Micron

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Santosh Kumar

VP & Head, Semiconductor Manufacturing

Reliance Industries Ltd

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Jason Zee

Global Vice President, General Manager of the Storage and System Level Test Group

Teradyne, Inc.

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Geoffrey Stoddart

Commercial Director

Westerwood Global

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