Advisory Board – ISES USA
International Semiconductor Executive Summits (ISES) advisory board includes leading experts from across the semiconductor sector including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Chairman: Dr. Hamid Azimi
Corporate Vice President, Intel Director, Substrate Packaging Technology Development
Intel
Vincent DiCaprio
VP Advanced Packaging and ICAPS / Head of Business and Corporate Development
Applied Materials
Jason Zee
Global Vice President, General Manager of the Storage and System Level Test Group
Teradyne, Inc.
ISES China
ISES China offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES Middle East
ISES Middle East in Oman offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES Japan
ISES Japan offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES Power
ISES Power in Europe offers opportunities to engage with political, business, financial, research and industry leaders of the power semiconductor manufacturing industry.
ISES SEA
ISES SEA in South-East Asia offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES Taiwan
ISES Taiwan offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
ISES USA
ISES USA in Arizona offers opportunities to engage with political, business, financial, research and industry leaders of the semiconductor manufacturing industry.
MEMS World Summit (MWS) China
MWS in China offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
MEMS World Summit (MWS) EU
MWS in Europe (EU) offers opportunities to engage with political, business, financial, research and industry leaders of the micro electrical mechanical systems (MEMS) manufacturing industry.
Join ISES
ISES Membership
Enjoy the following benefits with our annual memberships
Supplier Member
For Equipment | Materials | EDA | Software Suppliers
- Company Branding Service Included in Association
- Full Access to On-Demand Event Platform & Research Reports
- Company Logo Associated with ISES
Joining Fee: $5,000
Plus 7.5% service charge
Associate Member
For EDA | Design Services | OSATS | Foundries | IC Design Houses | End Users
- 1 Membership package per company for a whole year
- 1 Free VIP pass to all events for C/VP/GM/Director level executive from Technology, R&D, Manufacturing, Engineering, Operations & Purchasing departments
- All additional event passes will be registered at the lower member rate.
- Access to all 250+ shareable presentation slides from ISES events during your annual subscription period (this includes events you can’t make it to attend in person)
- First refusal to available speaker slots (subject to Advisory Board approval)
- Full year’s Membership company logo branding in association with ISES on online and offline materials
- Discounted member rates on ISES sponsorship packages
Joining Fee: $7,500
Plus 7.5% service charge