• 10:00 – 10:25

Keynote

3DFabric Advanced Packaging Technology Innovations for AI/HPC

The focus of this presentation is on the latest 3DFabric technology innovations for AI and high-performance computing.

The development trends and future applications will be introduced, along with the integrated challenges faced by advanced packages. These challenges include CPI challenges with evolved advanced Si technology, large CoWoS® integrated challenges, design standard and testing integration, and 3DFabric manufacturing complexity.

Watch on ISES TV >

Kathy Yan

Director SPIP

TSMC

View Full Profile

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

View Full Profile