10:45 – 11:35
Moderator
Salah Nasri
International Semiconductor Industry Group (I.S.I.G.)
Salah Nasri leads the International Semiconductor Industry Group, founded in 2010, it is a global leading semiconductor association known for its flagship platforms (The International Semiconductor Executive Summits), uniting top executives, government officials, researchers, and investors from around the globe to address challenges and opportunities in chip manufacturing and technology innovation. He guides the association in shaping crucial industry dialogues—ranging from trade regulations to cutting-edge chip design—and fosters collaborations that drive the future of the semiconductor sector. Salah studied International Relations and Economics at Oxford University, Loughborough University and in 2024 graduated from the Stanford Graduate School of Business Executive Program.
International Semiconductor Industry Group (I.S.I.G.)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Babak Sabi, Ph.D.
AWS Annapurna Labs
Dr. Babak Sabi is VP of Technology at AWS/Annapurna Lab. Babak joined AWS in 2024 after 40 years in Intel. Babak was Senior Vice President and the General Manager of Assembly & Test Technology Development (ATTD) at Intel Corporation. Since 2009, he has been responsible for the company’s packaging, assembly, and test process technology development. During Babak’s tenure in ATTD 2.5D and 3D Advanced Packages were developed and ramp to high Volume Manufacturing. Additionally ATTD team made many advancement in Substrate and Test Technology.
Prior to leading ATTD, Babak oversaw Intel’s Corporate Quality Network from 2002 to 2009 where he led product reliability, customer satisfaction and quality business practices.
Babak joined Intel in 1984 after receiving Babak his Ph.D. in solid state electronics from Ohio State University in 1984.
AWS Annapurna Labs
Company Profile
Launched in 2006, Amazon Web Services (AWS) began exposing key infrastructure services to businesses in the form of web services — now widely known as cloud computing. The ultimate benefit of cloud computing, and AWS, is the ability to leverage a new business model and turn capital infrastructure expenses into variable costs. Businesses no longer need to plan and procure servers and other IT resources weeks or months in advance. Using AWS, businesses can take advantage of Amazon’s expertise and economies of scale to access resources when their business needs them, delivering results faster and at a lower cost.
Today, Amazon Web Services provides a highly reliable, scalable, low-cost infrastructure platform in the cloud that powers hundreds of thousands of businesses in 190 countries around the world. With data center locations in the U.S., Europe, Singapore, and Japan, customers across all industries are taking advantage of our low cost, elastic, open and flexible, secure platform.
Panelist
Hamid Azimi, Ph.D.
International Semiconductor Industry Group (I.S.I.G.)
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
International Semiconductor Industry Group (I.S.I.G.)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Jerry Tzou
TSMC
Jerry Tzou recently retired from TSMC, where he wrapped up as Director of Advanced Packaging Business Development. He spearheaded the strategic growth of TSMC’s 3DFabric® platform— CoWoS®, InFO, TSMC-SoIC®, TSMC-SoW™, and COUPE™ for Co-Packaged Optics (CPO) —tying it to TSMC’s advanced silicon innovations. This work fueled next-generation applications in AI-driven high-performance computing, mobile, automotive, and IoT. Through synergistic collaboration with customers and partners inside and out, he drove significant revenue growth in advanced packaging.
Jerry’s 40-year semiconductor career included diverse roles at TSMC, a stint as VP of Product Operations at Global Unichip Corporation (GUC), a TSMC-affiliated design foundry, and advanced packaging work at Apple, National Semiconductor, Cirrus Logic, and select Silicon Valley startups. With a Master’s in Materials Science and Engineering from UC Berkeley, his expertise spans semiconductor packaging, operations, and business development.
TSMC
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
Panelist
Marvin Liao, Ph.D.
International Semiconductor Industry Group (I.S.I.G.)
Education :
- Ph.D., Materials Science, University of Texas, USA, 1989
- Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
- TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
- TSMC, Special Project, 2009 ~ 2010
- TSMC, Fab 6 Director, 2003 ~ 2009
- Chartered Semiconductor, 1997 ~ 2002 (Singapore)
- Applied Materials, 1994 ~ 1997 (USA)
- SGS Thomson Microelectronics, 1990 ~1994 (USA)
International Semiconductor Industry Group (I.S.I.G.)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
Panelist
Mostafa Aghazadeh
Chiplink Consulting LLC
Mostafa Aghazadeh is a seasoned industry leader and the President of Chiplink Consulting LLC, where he advises companies on advanced packaging technology and manufacturing.Previously, he spent 40 years at Intel, holding various leadership roles in Assembly & Test Technology Development. As a Corporate Vice President, he led Intel’s assembly process, materials, and equipment technology development.He currently serves on the technical advisory boards of BESI, Brewer Science, and IMEC and previously chaired the INEMI Board of Directors. He was also a member of Arizona State University’s New Economy Initiative and the School of Manufacturing Systems and Networks Industry Advisory Board.
Chiplink Consulting LLC
Company Profile
Provide consulting services in the areas of microelectronics advanced packaging technology, manufacturing, and supply chain including process, equipment, and materials.
Company Products & Services
Consulting Services
Japanese