13:40 – 14:20
Panel Session: Evolving Trends for Advanced Packaging and the Challenges for Supply Chain and End User Applications
Moderator
Monita Pau, Ph.D.
Onto Innovation
Monita Pau is currently Strategic Marketing Director for Advanced Packaging at Onto Innovation. She works with business leaders and executives to drive strategic planning and leads the development of collaborative initiatives to drive growth and innovation. With over 15 years of experience, her expertise spans across frontend and backend of line process control solutions as well as specialty materials for advanced packaging and assembly. Prior to joining Onto, she held various positions in applications engineering, marketing and strategic business development at DuPont and KLA. Monita holds a Ph.D. degree in Chemistry from Stanford University.
Onto Innovation
Company Profile
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
General Telephone: +1 978 253 6200
General email: info@ontoinnovation.com
Website: www.ontoinnovation.com
Panelist
Vincent Kim, Ph.D.
Samsung Electronics
Dr. Vincent (WooPoung) Kim is the Corporate EVP, Head of Packaging at Samsung Device Solutions Research America based in San Jose, California. Dr. Kim is responsible for leading the packaging division at Samsung Device Solutions Research America, dedicated to meeting industry’s needs for advanced chip packaging in high-performance systems. Prior to joining Samsung, he served as a System Architect for Signal Integrity and Power Integrity at Apple, where he played a crucial role in developing consumer computers. Before his tenure at Apple, Dr. Kim worked as an SI Manager in Snapdragon packaging at Qualcomm. Prior to that, he was a Co-Design Engineer in the Wireless Business Unit of Texas Instruments, where he specialized in optimizing the electrical design of OMAP packages and systems. Dr. Kim also gained valuable experience as an SI Engineer at Rambus, where he designed and analyzed memory systems.
Dr. Kim received his Ph.D degree in Electrical and Computer Engineering (ECE) at Georgia Tech in 2004, and his M.S. & B.A. degrees from KAIST, Korea in 1999 and 1997.
Samsung Electronics
Company Profile
Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.
Panelist
Jaesik Lee Ph.D.
SK Hynix
Dr. Jaesik Lee is Vice President of Package Engineering at SK hynix America. In this role, Jaesik is responsible for the research and development of advanced packaging for next generation High Bandwidth Memory (HBM) and pathfinding initiatives which enrich SK hynix’s innovations. He also focuses on the collaborations with customers to overcome HBM challenges associated with System in Packages (SIPs).
Prior to joining SK hynix America, Jaesik has held various key technical positions through Meta, Google, Nvidia, and Qualcomm where he drove advanced packaging technology developments, Packaging and System Co-optimization, and Manufacturing in Mobile, AI, and HPC applications. He received a PhD in mechanical engineering from University of Waterloo.
SK Hynix
Company Profile
An AI First Mover Leading the Global AI Memory Era
With our global technology leadership, SK hynix aims to provide greater value to all stakeholders, including our customers, partner companies, investors, local communities, and employees.
Moreover, we are working to strengthen our ESG management to create even more value, by moving away from the conventional business model of seeking only economic benefits, in pursuit of more social value and a healthier governance structure.
SK hynix will grow into a Full Stack AI Memory Provider, offering customized solutions tailored to the diverse needs of global customers, covering both DRAM and NAND flash, in the era of full-scale AI.
Panelist
Raja Swaminathan, Ph.D.
AMD
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
AMD
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Panelist
Bassel Haddad
SkyWater Technology
Bassel Haddad is Sr Vice President and General Manager of Advanced Packaging at SkyWater Technology. He leads all aspects of SkyWater’s advanced packaging business including technology development, engineering, marketing and Florida fab operations. He is responsible for building and scaling the business serving both the defense and commercial market sectors. He is focused on strengthening collaborations with the advanced packaging ecosystem, such as equipment and material vendors, government partners and research institutes & consortia, while driving the growth trajectory of the business.
Before joining SkyWater, Haddad was with Intel since 2011 holding various engineering and business leadership roles. Most recently, he was the Vice President and General Manager of edge device and AI products, in the network and edge group. In this role, he managed a multi-billion dollar P&L, and leading innovations in edge AI and Internet of Things, or IoT. Earlier in his career, he held roles in platform architecture, silicon development, systems and software engineering, delivering leadership products to various end markets.
Haddad holds a Bachelor’s and Master’s degree in electrical engineering from Technion – Israel Institute of Technology. He is the inventor of five USPTO-issued patents in the areas of digital communication and systems architecture.
SkyWater Technology
Company Profile
SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor manufacturer and a DMEA-accredited Category 1A Trusted Supplier. SkyWater’s Technology as a Service model streamlines the path to production for customers with development services, volume production and heterogeneous integration solutions in its U.S. facilities. This pioneering model enables innovators to co-create the next wave of technology within diverse categories including mixed-signal CMOS, ROICs, rad-hard ICs, MEMS, superconducting ICs, photonics and advanced packaging. SkyWater serves the growing markets of aerospace & defense, automotive, biomedical, industrial and quantum computing. For more information, visit: www.skywatertechnology.com.
