14:40 – 15:00

Advanced low inductance SiC Power Module with 3D wiring technology

An advanced 3D Wiring technology has been developed to increase the power density of modules equipped with silicon carbide (SiC) for electric vehicle (xEV). Applying the multi layer 3D wiring technology with copper pin-terminals demonstrates about twice the power density of a conventional copper clipped wiring structure. The ⊿Tvj power cycling lifetime of power modules with the developed 3D wiring technology is approximately five times longer than the conventional copper clipped wiring.

Thomas Heinzel

Head of Semiconductor Technical Division

Fuji Electric Europe GmbH