• 09:20 – 09:30

Advanced Packaging/Substrate Materials and Open innovation Platform

An increased density of IC chips and other components to increase processing speed highly will be required for post-5G/6G systems. Therefore, there is a need for technologies that allow for high-density packaging of differing chips within a single semiconductor package. In this presentation, Advanced Packaging and Substrate materials trend such as organic core, dry film, solder resist, PID for RDL and glass related materials would be introduced.

Furthermore, Open innovation activity using Resonac’s Advanced Packaging pilot line would be discussed. Resonac has started Packaging Solution Center to propose one-stop solution for customers in 2019 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package. We are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large advanced package. This presentation will cover these Resonac’s co-creation activities and development.

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Abe Hidenori photo

Hidenori Abe

Electronics R&D Center GM

Resonac Corporation

Mr. Abe is leading R&D of semiconductor materials in general and promoting co-creation activities at Resonac, which is an integrated company of Showa Denko K.K. and Showa Denko Materials Co., Ltd., (formerly Hitachi Chemical Co., Ltd.), After serving as a General manager of CMP slurry business sector and a corporate marketing manager at Hitachi Chemical.

He was involved in the launch of the Packaging Solution Center, which is open innovation hub in advanced packaging development.

He had been engaged in the development of semiconductor molding compounds since 1998.

He holds an Executive MBA from Oxford, UK.

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On January 1, 2023, Showa Denko K.K. and Showa Denko Materials Co., Ltd. merged and transformed themselves into newly integrated company “Resonac”. Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global No.1 semiconductor materials supplier (except for Si wafer). In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.

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