In contemporary electronic packaging, the pursuit of miniaturization, enhanced performance, and reliability remains a fundamental driving force. This abstract introduces a novel approach in advanced packaging through the utilization of Through Glass Vias (TGVs) for Glass Core Integration, as a viable alternative to Conventional Silicon (Si) Interposer technology. The presentation encapsulates the background, motivations, technical aspects, and results of our evaluation work in this innovative packaging paradigm.
The background of this research is grounded in the growing demand for smaller form factors, increased functionality, and improved thermal management in electronic devices. Traditional Si interposer technology, while effective, presents limitations in terms of scalability, thermal conductivity, and electrical performance. Thus, the exploration of alternative materials and methodologies is imperative for the next generation of packaging solutions.
Motivated by the exceptional properties of glass, including its thermal stability, electrical insulation, and compatibility with existing manufacturing processes, this study delves into the feasibility of utilizing glass as both a carrier and core material in advanced packaging. Through Glass Vias (TGVs) emerge as a key enabler, facilitating vertical interconnects within the glass substrate.
Key considerations such as through-hole requirements, aspect ratios, seed layer deposition, and adhesion to glass are meticulously addressed to ensure the integrity and reliability of the packaging structure. Innovative process technologies are developed to fabricate TGVs with precise dimensions, high aspect ratios, and robust electrical properties.
The hardware requirements for implementing TGV-based packaging are evaluated, encompassing equipment for laser drilling, seed layer deposition, plating, and planarization processes. Cost considerations are also examined to ascertain the economic viability of this approach compared to conventional methodologies.
Results from our evaluation work demonstrate promising advancements in TGV-based packaging, including enhanced electrical performance, superior thermal dissipation, and significant miniaturization potential. Through detailed analysis and experimentation, this presentation illuminates the transformative capabilities of Through Glass Vias for Glass Core Integration, heralding a new era in advanced packaging technology.