As semiconductor packaging evolves to meet the demands of AI, high-performance computing, and RF systems, traditional organic and silicon-based substrates are nearing their limits. Glass substrates are emerging as a compelling alternative, offering exceptional electrical performance, dimensional stability, and scalability. With ultra-low dielectric loss, fine-pitch interconnect capability, and compatibility with Through-Glass Vias (TGVs), glass enables higher signal integrity and integration density. Its thermal expansion match with silicon also enhances reliability in advanced packages. Despite challenges—such as mechanical fragility, TGV metallization, and thermal management—ongoing innovations in materials and process engineering are rapidly closing the gap. This keynote explores the transformative potential of glass substrates, the hurdles to their widespread adoption, and the collaborative efforts shaping a new ecosystem for next-generation semiconductor packaging.