• 11:10 – 11:30

Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap

For over 50 years, Moore’s Law has defined the pace of the semiconductor industry with its ability to scale transistor density every 2 years. While the front end roadmap is still progressing thanks to EUV lithography and other process technology innovations, it’s no longer sufficient to keep pace with the diversified demand of the new digital society.

In recent years, we have seen an acceleration of technical innovations in IC packaging and IC substrates to complement front end wafer fabrication technologies and meet performance, power, and cost requirements.

The implementation of heterogeneous integration started long ago with the first multi-chip modules and 2D packages and is now accelerating with several new 2.5 and 3D architectures serving various end-applications, including high-performance computing, mobile, and networking, among others.

With interconnect geometry scaling, we see the need and the opportunity to bridge process equipment and process control methodologies across the three worlds of front-end, packaging and substrates. These once completely separated domains are becoming integrated just like the packages and systems they create.

The adoption of front end-like technologies and methodologies into packaging and IC substrates is not trivial and it requires innovation and customization to meet cost and performance requirements.

KLA is partnering with key industry players to bridge these three worlds and this presentation will show the challenges we are facing and problems we are solving to advance the semiconductor technology roadmap.

Keywords: Innovation, Advanced Packaging, Technology Roadmap, Heterogeneous Integration, Substrates

Watch on ISES TV > PPTs in ISES Docs >
Oreste Donzella photo

Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

Oreste Donzella serves as Executive Vice President of the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which include multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.

Previously, Oreste covered wide range of positions at KLA, including Chief Marketing Officer (CMO), Customer Engagement VP, General Managers of the Surfscan and SWIFT product divisions and various other technical and business roles. of KLA.

Oreste brings ~30 years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent more than six years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.

Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy.

View Full Profile

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com

View Full Profile