11:10 – 11:30
Bridging Front End, Packaging And Substrates To Advance The Semiconductor Roadmap
For over 50 years, Moore’s Law has defined the pace of the semiconductor industry with its ability to scale transistor density every 2 years. While the front end roadmap is still progressing thanks to EUV lithography and other process technology innovations, it’s no longer sufficient to keep pace with the diversified demand of the new digital society.
In recent years, we have seen an acceleration of technical innovations in IC packaging and IC substrates to complement front end wafer fabrication technologies and meet performance, power, and cost requirements.
The implementation of heterogeneous integration started long ago with the first multi-chip modules and 2D packages and is now accelerating with several new 2.5 and 3D architectures serving various end-applications, including high-performance computing, mobile, and networking, among others.
With interconnect geometry scaling, we see the need and the opportunity to bridge process equipment and process control methodologies across the three worlds of front-end, packaging and substrates. These once completely separated domains are becoming integrated just like the packages and systems they create.
The adoption of front end-like technologies and methodologies into packaging and IC substrates is not trivial and it requires innovation and customization to meet cost and performance requirements.
KLA is partnering with key industry players to bridge these three worlds and this presentation will show the challenges we are facing and problems we are solving to advance the semiconductor technology roadmap.
Keywords: Innovation, Advanced Packaging, Technology Roadmap, Heterogeneous Integration, Substrates
Oreste Donzella
KLA
Oreste Donzella serves as Executive Vice President and Chief Strategy Officer at KLA Corporation, leading key corporate growth initiatives and working closely with external stakeholders, such as financial investors and end customers in the broad electronics ecosystem.
Prior to his current role, Oreste was Executive Vice President, managing the Electronics, Packaging and Component (EPC) business group at KLA Corporation, which included multiple product divisions, targeting growth opportunities in specialty semiconductors, packaging, printed circuit board and display markets.
Previously, Oreste was the Chief Marketing Officer (CMO) of KLA. In this role, he oversaw corporate marketing activities, market analytics and forecast, and companywide collaborations with the broad electronics industry.
In the years before his CMO role, Oreste led the world-wide field applications engineering team, and was responsible for Customer Engagement projects and product portfolio optimization for wafer inspection platforms at KLA.
Previously, Oreste was Vice President and General Manager of the Surfscan and SWIFT divisions at KLA-Tencor. In these positions, he was responsible for the unpatterned wafer inspection, wafer geometry, and macro inspection business, overseeing new products development, sales, and marketing activities, customer support, and ultimately, division financial performance (P&L).
Oreste brings 30+ years of experience in the semiconductor industry. Prior to joining KLA in 1999, he spent almost seven years at Texas Instruments and Micron Technology, holding engineering and management positions in the process integration and yield enhancement departments.
Oreste holds various patents and is featured in several technical publications.
In 2020, Oreste was awarded with VLSI Semiconductor All Star for “charting KLA’s path into new markets related to More than Moore semiconductor technologies”
Oreste earned his master’s degree in electrical engineering from the University La Sapienza in Rome, Italy .
Company Profile
KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at kla.com
