• 16:15 – 16:25

Co-Packaged Optics and Solutions for High Volume manufacturing

The rapid development of AI, IoT, 5G and high-performance computing applications has led to exponential growth in data traffic within data centers. Nearly three-quarters of this data traffic remains within the confines of data centers. Traditional pluggable optics cannot keep up with this surge. This is where Co-Packaged Optics (CPO) technology comes into play.

CPO represents a disruptive approach to increasing bandwidth density and energy efficiency. It achieves this by significantly reducing electrical interconnect lengths through advanced packaging and simultaneously optimizing electronics and photonics. Particularly on the silicon platform, CPO holds promise for future data centers.

International companies such as Intel, Broadcom, and IBM have heavily invested in CPO technology. This interdisciplinary research field encompasses photonic devices, integrated circuit designs, packaging, modeling of photonic components, electronic-photonics co-simulation, applications, and standardization.

The challenges in CPO production are diverse. These include integrating electronics and photonics, developing reliable packaging technologies, and standardization efforts. Nevertheless, CPO offers tremendous potential for the future of data center connectivity.

ASMPT as a key equipment supplier for CPO applications offers the solutions for high volume manufacturing of Co-Packaged Optics devices.

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Dr. Johann Weinhändler photo

Dr. Johann Weinhändler

Managing Director

ASMPT Limited

Holds an Electrical Engineering Degree from the DAG Technikum in Würzburg/Germany , an MBA from the Open University Business School in Milton Keynes/UK and am Ph.D in Economics from the Trinity Colleges in Dublin. He has over 30 years global Sales and Marketing experience in the semiconductor equipment industry. During his career he was working with Lam Research, Datacon, Oerlikon Systems and ASMPT AMICRA.

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ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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