• 16:45 – 16:50

Customized Silicon and SOI Wafers Enabling Enhanced Power Devices

Advanced silicon wafers can greatly improve power device performance and reduce power losses.

Bonded Silicon-On-Insulator (SOI) wafer is a cost-effective substrate choice for power management devices since its inherent isolation capability pushes towards monolithic integration reducing the die size. The device and buried oxide layer specification flexibility helps establish high freedom of design to streamline the chip development process.

Fully customizable gallium nitride (GaN) silicon substrate wafers with advanced stress management provide an enhanced platform for up to 1200 V lateral GaN power devices. All parameters including wafer thickness, crystal orientation and oxygen levels can be customized to enhance customer’s GaN epitaxy process efficiency and end product capability. Further benefits can be gained through GaN growth on SOI wafers. The layered structure of the SOI substrate enables monolithic integration increasing device performance and power efficiency, reduces dislocations and allows the use of thinner buffer layers.

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Dr. Atte Haapalinna photo

Dr. Atte Haapalinna

CTO

Okmetic Oy

Dr. Atte Haapalinna is chief technical officer at Okmetic, the leading supplier of advanced silicon wafers. He has published two dozen papers on various applications of advanced silicon substrates, silicon damage characterization and silicon photodetectors. Dr. Haapalinna has been with Okmetic since 1998, holding various positions including senior vice president of products, senior vice president of customer support and senior manager of new business development. He has participated in development of C-SOI® wafers, ultra-low resistivity wafers for power devices and engineered high resistivity wafers for RF filters and devices. Dr. Haapalinna received his Ph.D. at the Helsinki University of Technology (now Aalto University), Finland.

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Okmetic, founded in 1985, is the 7th largest silicon wafer manufacturer in the world and a true pioneer in the field of advanced silicon wafers. Okmetic supplies tailored, high value-added silicon wafers for the manufacture of MEMS, sensor, RF and power devices. Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. Okmetic’s operations rely on quality and environmental systems in line with the ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016 standards.

 

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