10:45 – 11:10
DRAM challenges and innovations for demanding AI workloads
We present the advancements in DRAM technology that have allowed us to enter the Artificial Intelligence (AI) Era. AI systems and applications have a high demand for memory and storage, which can result in high energy consumption if the technology follows the current scaling law. Therefore, to meet the high memory density, speed, and energy efficiency requirements for demanding AI workloads, we need to innovate High-Bandwidth-Memory (HBM), Processing-in-Memory, 3D DRAM, and Wafer Hybrid boding technology. These innovations require new materials for novel cell structures, new equipment for process development, and Extreme Ultra-Violet (EUV) technology for scaling. Micron is leading the way in developing and delivering energy-efficient products across portfolios and driving supply chains for advanced memory technology, enabling us to deliver breakthrough innovations to the market.
Shigeru Shiratake
Micron Technology, Inc.
Shigeru Shiratake is the Corporate Vice President for Technology Development’s DRAM and Emerging Memory research development organization. Shiratake joined Micron in 2013 as the Section Director of the DRAM process integration organization. Prior to joining Micron, Shiratake was an executive of Elpida Memory (acquired by Micron in 2013) between 2005 – 2013, leading several DRAM programs. Shiratake experience spans 35 years in the memory technology sectors, and includes additional leadership positions with Renesas Technology Inc., and Mitsubishi Electric, Corp. Shiratake is a published author of many technical papers, holds dozens of patents pertaining to semiconductor technology.
Micron Technology, Inc.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
