16:50 – 17:00
Dry Laser Cleaning Solution
Femtum’s laser cleaning solution offers precise, dry, and selective removal of particles, residues, and films from photonic and semiconductor surfaces. its laser solution targets contaminants—such as epoxy, dust, and grease—without damaging sensitive substrates like Si, SiO₂, or gold. The system integrates vision, software, and high-speed scanning for localized or area-wide cleaning, enabling higher yield, safer processing, and automation-ready deployment in advanced packaging and silicon photonics.
Simon Duval, Ph.D.
Femtum
Simon Duval is the co-founder and CTO of Femtum, leading R&D and engineering activities. During its PhD and post-doctoral fellowship, he developped the first mid-IR femtosecond fiber laser and received the maiman award for the best paper at Photonics West. He is the inventor of 6 patents in laser and laser processing development that are extensively used at Femtum. Simon is also a board member and treasurer of Optonique, the Quebec Photonics Cluster.
Femtum
Company Profile
Femtum is a fast-growing Canadian company redefining semiconductor manufacturing for the AI era, helping fabs overcome critical yield barriers and unlock new design frontiers — powered by its proprietary fiber laser platform. Over the past decades, our team developed a unique know-how and patented technologies to make a difference in the laser industry. With this deep understanding of mid-infrared fiber laser technologies, we bring innovative solutions to solve manufacturing bottlenecks in the semicon industry.
Company Products & Services
Femtum delivers laser solutions tailored for the needs of the semicon industry. These solutions enable manufacturing process efficiency, cutting-edge innovation, and set industry standards.
The Femtum’s solution combines:
Optical Head — engineered for high-speed, non-contact precision, equipped with advanced focusing optics, galvo scanning, in-line vision modules, and illumination sources. The system actively monitors and aligns the laser process in real time, ensuring consistent, repeatable results across the component or wafer.
Laser Source — a compact, robust architecture designed for easy integration into existing wafer-level or packaging equipment. With options for standalone or retrofit deployment, this source adapts to diverse customers environments while delivering sub-micron accuracy and long-term stability.
