15:00 –
Enabling the future of Wafer-level MEMS test and MEMS WLCSP final test
MEMS testing is facing new challenges in terms of wafer-level solutions for production volumes. On one hand, there is no doubt that testing prior to packaging is beneficial for several reasons, resulting at the end in production cost reduction and faster time to market. On the other hand, a reliable wafer-level test of MEMS and sensors cannot be limited to the electrical characteristics of the devices. Dynamic testing of MEMS devices requires a new-generation of test equipment, able to determine and analyze also the device mechanical functions by measuring its non-electrical behavior. Field-proven equipment for the wafer-level sensor test of MEMS devices like accelerometers, gyroscopes, pressure sensors, magnetic sensors, are expected to be adopted as a standard by the industry. Another test challenge concerns the growing adoption of the wafer-level chip scale packaging technology (WLCSP) for MEMS sensors and actuators, in both consumer and automotive fields. The adoption of a complete solution for the production final test of WLCSP MEMS devices will be essential. Such equipment must be able to perform the high-throughput, soft handling of the devices directly from a diced wafer on film frame, to stimulate and test the devices at tri-temp, to perform the finishing on reel after testing. This presentation will explore these challenges, providing possible solutions, raising open points and questions.
Yuanli Sun
SPEA
Yuanli Sun received her M.S. degree in Industrial Management from the Polytechnic of Turin (Italy) in July 2012. She joined SPEA during her last academic year as a semiconductor testing equipment application engineer. She rapidly achieved being responsible for application development projects for IC, Power and MEMs devices，technical expertise that involve data modeling and analysis, C/C++ program languages, also, she participated in the design of extremely accurate measurement modules that are widely used in MEMS wafer testing.
With such a strong and well prepared background, in 2014, Yuanli establishes a wholly owned subsidiary of SPEA in China, where she’s responsible in full for SPEA’s business development and after-sales service in China. Riding the wave of success, Yuanli establishes more offices in Suzhou, Shenzhen, and Chongqing to enhance the popularity and reputation of SPEA in China.
Today, as General Manager of SPEA China, her group has worked directly with SPEA’s customers to develop state-of-the-art technology for testing high volume Power Modules, MEMS test cell, wafer level tester high parallelism solutions.
孙媛丽于2012年7月获得了意大利都灵理工学院的工业管理硕士学位。她在最后一个学年加入 SPEA，担任半导体测试设备应用工程师，主要负责IC、Power和MEMS器件的应用开发项目，她精通数据建模和分析、C/C++语言编程等专业技能，参与设计了广泛应用于MEMS晶圆测试的高精密测量模块。
凭借雄厚的技术背景，她于2014年在中国成立了SPEA的全资子公司，全面负责SPEA在中国的业务发展和售后服务。她抓住风口乘势而上，在苏州、深圳和重庆设立了更多的办事处，持续提升SPEA在国内的知名度和声誉。
如今，作为 SPEA 中国区总经理，她的团队直接与 SPEA 的客户合作，开发最先进的技术用于测试高功率模块、MEMS 测试单元、晶圆级测试仪高并行度解决方案。
SPEA
Company Profile
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Company Products & Services
- SPEA product portfolio includes test equipment for:
- Automotive, linear, analog mixed signal & SoC devices requiring the most advanced and powerful instrumentation. SPEA’s DOT platform addresses today’s and future roadmap needs.
- MEMS & Sensors. SPEA has been chosen by the biggest players in this market to develop the best solutions for inertial, high-g, proximity, time-of-flight, light, pressure, environmental, magnetic, acoustic sensors. SPEA equipment combines physical stimulus with a complete electrical test, fast pick&place handling, reliable contacting, tri-temp.
- Power & Discretes. DOT800 T perforfms static and dynamic measurements with extended current/voltage ranges, on the whole range of power applications: wafers, discretes (Si, SiC, GaN based), IPMs, KGDs, DBCs, IGBT modules.
- Identification. CT1000 and CT3000 are low-cost test systems dedicated to micro-controllers, RFID, UHF, combi devices. They perform complete, highly accurate measurements, offering high throughput, with high multi-site test capability at wafer test, and a fast data transfer for memory test.
