• 15:00 –

Enabling the future of Wafer-level MEMS test and MEMS WLCSP final test

MEMS testing is facing new challenges in terms of wafer-level solutions for production volumes. On one hand, there is no doubt that testing prior to packaging is beneficial for several reasons, resulting at the end in production cost reduction and faster time to market. On the other hand, a reliable wafer-level test of MEMS and sensors cannot be limited to the electrical characteristics of the devices. Dynamic testing of MEMS devices requires a new-generation of test equipment, able to determine and analyze also the device mechanical functions by measuring its non-electrical behavior. Field-proven equipment for the wafer-level sensor test of MEMS devices like accelerometers, gyroscopes, pressure sensors, magnetic sensors, are expected to be adopted as a standard by the industry. Another test challenge concerns the growing adoption of the wafer-level chip scale packaging technology (WLCSP) for MEMS sensors and actuators, in both consumer and automotive fields. The adoption of a complete solution for the production final test of WLCSP MEMS devices will be essential. Such equipment must be able to perform the high-throughput, soft handling of the devices directly from a diced wafer on film frame, to stimulate and test the devices at tri-temp, to perform the finishing on reel after testing. This presentation will explore these challenges, providing possible solutions, raising open points and questions.

Yuanli Sun photo

Yuanli Sun



Yuanli Sun received her M.S. degree in Industrial Management from the Polytechnic of Turin (Italy) in July 2012. She joined SPEA during her last academic year as a semiconductor testing equipment application engineer. She rapidly achieved being responsible for application development projects for IC, Power and MEMs devices,technical expertise that involve data modeling and analysis, C/C++ program languages, also, she participated in the design of extremely accurate measurement modules that are widely used in MEMS wafer testing.

With such a strong and well prepared background, in 2014, Yuanli establishes a wholly owned subsidiary of SPEA in China, where she’s responsible in full for SPEA’s business development and after-sales service in China. Riding the wave of success, Yuanli establishes more offices in Suzhou, Shenzhen, and Chongqing to enhance the popularity and reputation of SPEA in China.

Today, as General Manager of SPEA China, her group has worked directly with SPEA’s customers to develop state-of-the-art technology for testing high volume Power Modules, MEMS test cell, wafer level tester high parallelism solutions.

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Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

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