Heterogeneous Integration requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.

A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.