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EVATEC – Thin Film Production Solutions for HeterogeneousIntegration

Heterogeneous Integration requires knowledge in functional layers within the dies, along with expertise in Advanced Packaging. Whereas the first part is genuinely core competence of Evatec for piezoelectric sensing or actuating elements, we also have a strong footprint in the AP court. The interdisciplinary approach is of the essence there, for instance in heat dissipation, magnetic shielding, or stress compensation. Mastering the 3rd dimension is also common for both MEMS and AP, where TSVs are elementary.

A variety of deposition technologies such as PVD, PECVD and PEALD on specific tool concepts (batch, single wafer or inline) enables the realization of interesting combinations. This is where Photonics, Optoelectronics, Semiconductors and Advanced Packaging come together – forming today’s MEMS devices.

Dr. Yuan Lu photo

Dr. Yuan Lu

Manager Technical Marketing Management


Dr. Yuan Lu, manager technical marketing management at Evatec China. He participated in the project of BAW device research and development between Evatec and global RF-filter top companies. Besides, he was doing of the strategic marketing of MEMS state-owned company, including filter, IMU, temperature and gas MEMS project cooperation and investment. Currently his team is focusing on the solution and strategic marketing of business unit semiconductor, optoelectronics, photonics in Evatec China.

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Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.

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