• 15:10 – 15:55

Future of Taiwanese Semiconductor Supply Chain: Collaborations with International Partners

Ray Yang photo

Ray Yang

Consulting Director, Industry, Science and Technology International Strategy Center (ISTI)

Industrial Technology Research Institute (ITRI)

Ray Yang is consulting director at Industry, Science and Technology International Strategy Center of ITRI (Industrial Technology Research Institute), which is one of influential think tanks in Taiwan. Ray currently serves as principal investigator of semiconductor cross-disciplinary research group for National Science and Technology Council of Taiwan. He is also appointed by ITRI HQ as BD director at Office of Business Development. Ray is responsible for emerging technology and market dynamics research especially about semiconductors as well as industry-related geo-political issues.

Ray has more than 30 years’ experience with semiconductor industry, and had been advisor to Horizon 2020 “NanoElectronics Roadmap for Europe: Identification and Dissemination” 3-years’ project, and continues to serve as international advisor to Horizon Europe project “International Cooperation on Semiconductors” since 2023. Ray is serving as committee member at SEMI Taiwan Packaging & Testing, Smart Manufacturing, and MEMS & Sensors committees.

Ray’s analysis and commentary have been featured in the New York Times, the Wall Street Journal, Al Jazeera, Deutsche Welle, Voice of America, Radio Free Asia, Le Monde, among others. He also regularly appears on Taiwan’s media such as Central News Agency, Radio Taiwan International, United Daily News, Liberty Times, and has provided commentary for ERA TV, a Taiwanese broadcast media outlet.

Ray holds a MBA from Tel-Aviv International School of Management in Israel, and receives bachelor degree of electrical engineering with honor from National Tsing Hua University of Taiwan in 1986.

View Full Profile

ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.

View Full Profile
Dr. Bill En photo

Dr. Bill En

CVP, Foundry Technology and Operations


26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

View Full Profile

For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

View Full Profile
Albert Lan photo

Albert Lan

Global Packaging Account TD Head

Applied Materials


  • Over 30 years of job experience in semiconductor industry, especially focusing on advanced packaging technologies.
  • Senior Engineering Center RD Head, 13 years, SPIL, which is top 3 biggest assembly house in the world.
  • PD, Quality, & Sales, 5 years, Amkor Taiwan(Bumping)
  • Vice Chairman of SEMI Taiwan PKG&TEST Committee.
  • Executive Co-Chair – PKG Committee of IMPACT / TPCA.
  • Chairman of TILA (Taiwan Intelligent Leader Association).
View Full Profile

We are the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible® a Better Future.

View Full Profile
Bruce Lu photo

Bruce Lu

VP Asia Technology

Goldman Sachs

Bruce Lu joined Goldman Sachs in 2018 as a Vice President and works in the Global Investment Research team where he is responsible for covering Asia technology stocks. He previously worked at Barclays, HSBC and CLSA, with a combined experience of 17 years in equity research covering semiconductor industry. Prior to equity research, Bruce worked at UMC, Applied Materials and JAFCO Asia as a senior investment manager. Bruce has a Master’s degree in Mechanical Engineering from Cornell University.

View Full Profile

The Goldman Sachs Group, Inc. is a leading global financial institution that delivers a broad range of financial services to a large and diversified client base that includes corporations, financial institutions, governments and individuals.

Founded in 1869, the firm is headquartered in New York and maintains offices in all major financial centers around the world.

View Full Profile
Dr. Kuan-Neng Chen photo

Dr. Kuan-Neng Chen

Chair Professor


Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, and a Research Staff Member at IBM Thomas J. Watson Research Center. 

Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NSTC Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (7 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 67 book chapters, and holds 87 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society. 

In addition to his faculty position, Dr. Chen is Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration. 

View Full Profile

NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.

At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.

View Full Profile
Jian Zhang photo

Jian Zhang

VP Product Test Engineering

Qualcomm Technologies Inc.

Jian is a semiconductor industry veteran with more than 25 years of experience in process technology development, foundry operations, product engineering. Jian has extensive experience in leading and integrating global teams from various regions and businesses, having spent more than a decade in the U.S. and Asia.

Jian is the Vice President in Qualcomm, leading the Product Test Engineering (PTE) in APAC, responsible for new product test development, characterization, and test deployment, yield management, integrating and optimizing performance for all products across the BUs. She also oversees technical and management coordination with the PTE teams in the U.S.

Prior to Qualcomm, Jian served as VP of technology at NXP, responsible for technology roadmap planning and execution, both for in-house fabs and foundries. She also partnered with foundry and internal teams to ensure all new products and foundry processes would meet the automotive quality requirements and work

Jian held various management positions, including Global Foundries and Hewlett Packard. She holds master’s and bachelor’s degree in Electrical Engineering from Purdue University

View Full Profile

Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.

View Full Profile