• 11:30 – 11:50

Generative AI Driven Advanced Packaging and Materials Innovation

We have seen a tremendous explosion of computational growth for generative AI. The wide range of use cases is driving innovation to grow and expand AI model complexity. This expansion is driving a continued need to innovate the computational capabilities of the generative AI processors. More compute requires more memory, more performance and more SERDES data rates. All of this requires immense power to run. New advanced packaging technology, process technology and materials are needed to ensure we have the hardware to drive the AI revolution.

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Dr. Bill En

CVP, Foundry Technology and Operations

AMD

26 years of experience in the Semiconductor Industry ranging from silicon wafer R&D, process technology, circuit design and foundry technology with over 65 patents and 30 publications. He graduated from Univ. of California Berkeley with a Ph.D in Electrical Engineering and Computer Sciences in 1996. He is currently Corporate Vice President at Advanced Micro Devices overseeing Foundry technology from initial R&D through production for all AMD products.

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For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.

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