- 09:30 – 09:55
Glass Core Substrate: Next Gen Advanced Packaging Technology
Advanced packaging is enabling unprecedented levels of product performance as logic and memory chiplets are connected in unique architectures merging back-end silicon fabrication with package assembly. To meet future scaling, high speed signaling and power delivery needs, the package substrate must evolve beyond the capabilities offered by organic substrates. Glass substrates contain the
mechanical, physical and optical properties that allow for more transistors to be delivered in a package, providing better scaling and enabling the assembly of larger chiplet complexes. Intel is driving glass substrate technology and supply chain for advanced packaging solutions and plans to deliver this breakthrough innovation to the market in the second half of this decade.
Dr. Hamid Azimi
Dr Hamid Azimi, an Intel VP in Technology Development group, is responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
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