09:00 – 09:25
Keynote
Glass Core Substrate: Next Gen Advanced Packaging Technology
Advanced packaging is enabling unprecedented levels of product performance as logic and memory chiplets are connected in unique architectures merging back-end silicon fabrication with package assembly. To meet future scaling, high speed signaling and power delivery needs, the package substrate must evolve beyond the capabilities offered by organic substrates. Glass substrates contain the
mechanical, physical and optical properties that allow for more transistors to be delivered in a package, providing better scaling and enabling the assembly of larger chiplet complexes. Intel is driving glass substrate technology and supply chain for advanced packaging solutions and plans to deliver this breakthrough innovation to the market in the second half of this decade.
Hamid Azimi, Ph.D.
International Semiconductor Industry Group (I.S.I.G.)
Dr Hamid Azimi, formerly Corporate VP, Director of Substrate Packaging TD of Intel. He was responsible for advanced substrate packaging for all Intel logic products across substrate suppliers’ factories, as well as the company’s two internal substrate R&D factories. These R&D factories are the birthplace of panel level die embedding technology and play a crucial role for enabling EMIB, the key technology to Intel’s data-centric business and heterogenous packaging. His team works with equipment, material, chemical and substrate suppliers to develop Si-fab backend-like technologies for panel level advanced packaging, and transfer technologies to Intel supplier factories to meet the demand of future Intel products.
International Semiconductor Industry Group (I.S.I.G.)
Company Profile
Established in 2010, the International Semiconductor Industry Group (ISIG) is a prestigious and trusted global platform, known for fostering collaboration and driving innovation across the semiconductor industry. With a strong foundation through its International Semiconductor Executive Summits (I.S.E.S.), ISIG orchestrates influential regional summits across the U.S., Middle East, Europe and Asia, fully endorsed by local governments and leading companies throughout the semiconductor supply chain.
At ISIG, we are more than just event organizers—we serve as a catalyst for shaping the future of the semiconductor industry. Through high-level executive recruitment, expert consultation, and strategic investor engagement, ISIG empowers global collaboration, helping industry leaders connect, collaborate, and innovate. Our vision is to create a trusted network that transcends borders and disciplines, uniting government officials, academic experts, and investors to tackle the most pressing challenges and seize the greatest opportunities in the semiconductor ecosystem.
Together, we ensure the semiconductor industry remains at the forefront of technological advancement and economic growth, shaping a sustainable future for the global market.
