16:30 – 16:40
Glass Substrates for Advanced Packaging
For over 50 years, Corning Advanced Optics has met ever-increasing challenges to help enable semiconductor industry leaders produce smaller and more powerful chips. Corning has continuously invested in R&D to deliver an innovative and diverse set of glass and crystal components and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging.
The explosion of Artificial Intelligence (AI) accelerator demand has driven the need for innovative glass-based advanced packaging solutions to enable the most powerful AI systems. Today, Corning’s glass wafer carriers support High-Bandwidth Memory stacking and 2.5D packaging of chiplets on silicon interposers. Looking to future, our unmatched expertise in specialty glasses and years of groundbreaking Through Glass Via research efforts will enable us to deliver future glass substrates for heterogeneous integration, advancing our partnership with industry-leaders.
Dr. Xavier Lafosse
Corning Incorporated
Lafosse graduated from the Ecole Nationale Supérieure de Chimie de Paris and received a doctorate in material physics from Paris University, France.
Lafosse joined Corning in 1995 as a scientist at the Corning European Technology Center in France. He held several positions in R&D, developing a variety of glass and polymer optical materials and supporting several Corning businesses.
In 2007, he relocated with his family to Corning, NY and was appointed business technology director for Specialty Materials. In this position, he established critical technical capabilities in support of Corning® Gorilla® Glass business growth and contributed to several new product introductions.
In 2019, he was appointed commercial technology director, Advanced Optics. In this role, he works with customers and semiconductor industry leaders to identify new trends and opportunities and to drive the technology road mapping process.
Company Profile
Solving the World’s Toughest Optical Challenges with Innovation, Collaboration, and Precision.
Corning’s diverse Advanced Optics portfolio reflects our deep understanding of the properties of light, its interaction with matter, and the instruments used to detect it. For decades, we have been a trusted optics collaborator with leaders in a wide range of markets, including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. We offer a diverse set of optics technologies providing solutions to full complex systems. Customer collaboration is the hallmark of our operations.
The Semiconductor Technologies & Solutions business is growing its investments to deliver an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.
Learn more:
Semiconductors: Corning doesn’t just chip in; we help lead the way
Corning’s glass innovations help artificial intelligence enhance the way we work, learn, and live.
About Corning Incorporated
Corning is vital to progress – in the industries we shape and in the world we share. We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives. Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers.
Company Products & Services
- Optical glass and crystalline materials for lithography tools (Deep-UV lenses and Extreme-UV mirrors and photomask blanks)
- Optical assemblies (modules, objectives) for Deep-UV, UV, Vis optical inspection tools
- Glass substrates for advanced packaging:
- Glass wafer temporary carriers for 2.5D, 3D packaging, Fan-Out, Si/SiC wafer thinning
- Glass panel for panel-level Fan-Out, glass core substrates
