• 11:50 – 12:20


Heterogeneous Integration Platform for Next Generation Computing

Today’s era of smartphones, 5G, AI and big data calls for increasingly faster speeds of computing performance. However, the speed of semiconductor innovation and technology advancement has slowed down, and chip miniaturization has reached physical limits, which has caused the speed at which transistors are growing smaller to slow down. In other words, we are now falling behind Moore’s Law.

Advances in heterogeneous chip packages are need to empower today is the device manufacturers to pursue tomorrow’s breakthrough. Both 2.5D and 3D will be needed to keep innovation vibrant also higher bandwidths and density solution is important for HPC and AI systems. So memory coherency and low latency attributes across converged compute infrastructures with interconnect technologies including UCIe.

In this paper, advanced package solutions are to be introduced and discussed in terms of challenges and opportunities for emerging high end computing, memory and mobile platforms.

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Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

Corporate VP / PKG Group, Product Technology, S.LSI

Samsung Electronics

Dr. YOON is currently working as Corporate VP/Head of Group, PKG group, Product Technology, S.LSI, Samsung Electronics. Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. ”YOON” received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

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Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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