Moderator
Curtis Zwenger
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He was formerly responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Panelist
Ahmer Syed
Qualcomm Technologies
Qualcomm Technologies
Company Profile
Qualcomm is the world’s leading wireless technology innovator and the driving force behind the development, launch, and expansion of 5G. When we connected the phone to the internet, the mobile revolution was born. Today, our foundational technologies enable the mobile ecosystem and are found in every 3G, 4G and 5G smartphone. We bring the benefits of mobile to new industries, including automotive, the internet of things, and computing, and are leading the way to a world where everything and everyone can communicate and interact seamlessly.
Panelist
Tony LoBianco
Skyworks Solutions
Tony is Sr Director of Global Packaging for Skyworks Solutions. His teams lead advanced packaging R&D and production for wireless semiconductor products, including cellular, infrastructure, automotive, defense, IoT, and others.
He holds degrees in Chemical Engineering from the University of Illinois Champaign-Urbana and an MBA in Technology Management.
Skyworks Solutions
Company Profile
Skyworks Solutions, Inc. is empowering the wireless networking revolution. Our highly innovative analog semiconductors are connecting people, places and things spanning a number of new and previously unimagined applications within the automotive, broadband, cellular infrastructure, connected home, industrial, medical, military, smartphone, tablet and wearable markets.
Skyworks is a global company with engineering, marketing, operations, sales and support facilities located throughout Asia, Europe and North America.
Company Products & Services
Skyworks products are used in aerospace, automotive, broadband, cellular infrastructure, connected home, defense, entertainment and gaming, industrial, medical, military, smartphone, tablet, and wearable markets.
Panelist
Deepak Kulkarni, Ph.D.
AMD
Deepak Kulkarni is a Senior Fellow at Advanced Micro Devices (AMD), where he leads the Instinct and Optics Technology Development team. In this role, he develops heterogeneous architectures for AMD’s AI accelerator products and oversees Photonics technology development.
With twenty years in technology development, Deepak has led the development of several innovative technologies such as panel-level fan-out, Embedded Multi-die Interconnect Bridge (EMIB), Elevated Fan-Out Bridge (EFB), and 3.5D packaging solutions. Recognized with top awards at both AMD and Intel, and a frequent voice on high-level industry panels, Deepak brings both technical depth and strategic vision to advancing heterogeneous integration.
Deepak’s technical interests cover Co-packaged Optics, Panel-level packaging, and design-technology co-optimization. He holds forty patents and has published over twenty papers. He earned his PhD in Mechanical Engineering with a minor in Computational Science from the University of Illinois at Urbana-Champaign.
AMD
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
Panelist
Rahul Manepalli, Ph.D.
Intel Corporation
Dr. Rahul Manepalli is an Intel Fellow, Vice President and Director of the Substrate & Wafer Assembly Technology Development organization in Intel. He currently leads the IC substrate technology development and 3DIC wafer assembly technology development teams in Intel’s Advanced Packaging Technology and Manufacturing Organization. He and his team are driving the pathfinding & development of materials, processes and equipment for the next generation of substrate, wafer level assembly technologies. His team has been the driving force behind many of the technology innovations in Intel’s Embedded Multi-die Interconnect Bridge (EMIB/EMIB-T), Panel ODI, Glass core substrate, Foveros (Solder and HBI die to wafer interconnect) technologies. Over his 25+ year career at Intel, Rahul has also held leadership roles in Intel’s assembly materials development and pathfinding teams leading to several innovations in encapsulants, thermal interface materials and solder alloys. Rahul is the author of over 250 patent publications in semiconductor packaging, over 50 technical papers and invited talks. He has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.
Intel Corporation
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
