• 17:20 – 17:30

Innovative laser assisted bonding processes for next generation advanced packaging

Conventional assembly techniques like thermo-compression bonding, oven reflow, or thermossonic wire bonding introduce high thermal and mechanical stress into the contacts and the entire semiconductor package, leading to warpage, cracks, or delamination effects. Moreover, the increasing significance of the IMC-layer becomes crucial when considering further miniaturization roadmaps of solder-based contacts << 16μm using these conventional bonding processes. To address this, “PacTech” has been developing laser-assisted processes since 1995, which enable high dynamic local and selective heating and are therefore ideal for next-generation advanced packaging. Laser-assisted reflow (LAR) of C4 bump arrays and SMD-populated substrates, laser-assisted chip bonding (LAB) and debonding processes (LAdB) as well as laser-soldered wire bonding (SB²-WB) for high-power devices, will be introduced and explained as alternative bonding solutions.

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Matthias Fettke photo

Matthias Fettke

VP Advanced Packaging Equipment


  • Holding a Master´s degree in Laser- and Optical Technology from the University of Applied Science Ernst Abbe in Jena Germany
  • Expertise in integrating optical waveguides into thin glass sheets for photonic packaging and in laser bonding of photonic components acquired during his work at Fraunhofer IZM and IOF
  • He was jointly responsible for the production of the 1st generation of electrostatic chucks for ASML EUV lithography systems and worked for 8 years as leading senior product manager in the E-static Chuck production center in Berlin
  • For more than 10 years he is active in the field of semi-conductor packaging for PacTech. He is a specialist for laser-assisted bonding technologies and holds more than 50 patens and publications
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PacTech-Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic & advanced packaging industry and offers wafer level bumping & packaging contract manufacturing out of Nauen, Germany (HQ), and through the 100% subsidiaries PacTech USA Inc., Silicon Valley, USA and PacTech ASIA Sdn., Bhd., Penang, Malaysia.

The equipment product line consists of solder jetting equipment (SB2-Jet), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).

Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.

The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing, chip singulation, tape & reel services.

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