14:05 – 14:25
Innovative Packages, Big Power: The Rise of Advanced Power Packaging
David Clark
Amkor Technology, Inc.
David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Before joining Amkor, David had held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted five patents in Optoelectronics and Device Packaging and holds a BEng Honours Degree in Electronic, Electrical, and Optoelectronic Engineering from the University of Glasgow.
Amkor Technology, Inc.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
