16:50 – 17:00
Interconnects of complex heterogeneous integration structures
Major trend and interconnection technology development direction for complex heterogeneous integration structures
Nelson Fan
ASMPT Semiconductor Solutions
Vice President, Advanced Packaging Product Portfolio Management and Business Development of ASMPT SEMI, is a distinguished leader and innovator with over three decades of impactful contributions to the semiconductor industry. His career is characterized by a unique blend of entrepreneurial vision, deep technical expertise, and a proven track record in senior executive management.
ASMPT Semiconductor Solutions
Company Profile
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
