• 14:30 – 14:55

New Level Innovation of Advanced Heterogeneous Integration in AI Era

As the demand for increased data bandwidths and additional functionalities intensifies in AI era, advanced packaging has garnered much interest as a key potential solution. The value of advanced packaging technology lies in enabling heterogeneous integration and chiplet solutions. Advances in heterogeneous chip/chiplet packages are essential for empowering today’s device manufacturers to pursue tomorrow’s breakthroughs. Advanced packaging solutions including FOPKG (FOWLP, FO Panel level packaging) and 3D variations are necessary to keep innovative vibrant.

For high-performance computing (HPC) and AI-edge applicatoins, advanced package has been developed based on a FOPKG, silicon interposer, embedded silicon bridge, or re-distribution (RDL) interposer integrating multiple logic devices, including chiplets and memory. This allows for a higher data transfer system capability. The next-generation heterogenous integrations are based on chiplet technology, where logic or memory dies are placed on top of the logic die or vice versa. Further down the line, the combination of wafer level integration, 3D-TSV and interposer technologies will contribute to request to fulfil the needs of ultra-high-performance in data transfer and minimized the system package form factor.

This presentation introduces Samsung’s advanced package platform for AI, mobile and automotive, in terms of echnical challenges, and opportunities for emerging chiplet applications. It also discusses the current activities of advanced packaging and industrial collaboration in the supplychain and ecosystem for further systematic integration and product innovation.

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Dr. Seungwook Yoon photo

Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung Electronics

Dr. YOON is currently working as Corporate VP/Business Development Team, AVP, Samsung Electronics

Prior to joining Samsung, He was director of group technology strategy, STATS ChipPAC, JCET Group. He also worked deputy lab director of MMC (Microsystem, Module and Components) lab, IME (Institute of Microelectronics), A*STAR, Singapore. YOON received Ph.D degree in Materials Science and Engineering from KAIST, Korea. He also holds MBA degree from Nanyang Business School, Singapore. He has over 300 journal papers, conference papers and trade journal papers, and over 20 US patents on microelectronic materials and electronic packaging. Served as technical committee member of various international packaging technology conferences, EPTC, ESTC, iMAPS, IWLPC and SEMI.

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Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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