As the demand for increased data bandwidths and additional functionalities intensifies in AI era, advanced packaging has garnered much interest as a key potential solution. The value of advanced packaging technology lies in enabling heterogeneous integration and chiplet solutions. Advances in heterogeneous chip/chiplet packages are essential for empowering today’s device manufacturers to pursue tomorrow’s breakthroughs. Advanced packaging solutions including FOPKG (FOWLP, FO Panel level packaging) and 3D variations are necessary to keep innovative vibrant.

For high-performance computing (HPC) and AI-edge applicatoins, advanced package has been developed based on a FOPKG, silicon interposer, embedded silicon bridge, or re-distribution (RDL) interposer integrating multiple logic devices, including chiplets and memory. This allows for a higher data transfer system capability. The next-generation heterogenous integrations are based on chiplet technology, where logic or memory dies are placed on top of the logic die or vice versa. Further down the line, the combination of wafer level integration, 3D-TSV and interposer technologies will contribute to request to fulfil the needs of ultra-high-performance in data transfer and minimized the system package form factor.

This presentation introduces Samsung’s advanced package platform for AI, mobile and automotive, in terms of echnical challenges, and opportunities for emerging chiplet applications. It also discusses the current activities of advanced packaging and industrial collaboration in the supplychain and ecosystem for further systematic integration and product innovation.