Advanced Driver Assistance Systems (ADAS) are designed to help the driving process and enhance car/road safety. Automotive optical sensors enable ADAS and the autonomous driving transition from SAE J3016 Level 2 towards Level 4/5, according to SAE International (formerly the Society of Automotive Engineers).

Current optical sensor chip designs require custom package solutions which have assembly packaging and test challenges. In addition, stringent reliability requirements increase the development time to select materials, run process evaluation, optimize process parameters and complete reliability verification for automotive applications.

New automotive optical package innovations extend Amkor’s broad package portfolio capabilities and expertise to benefit automotive customers. The solution to current automotive image sensor application challenges involves creating a package platform that utilizes an assembly open toolbox, adopts a new generation of wafer fabrication requirement, achieves faster development cycle time and manages cost efficiency.

This presentation will discuss a standard package platform to design alternative package solutions, overcome technical challenges and satisfy the Automotive Electronics Council’s AEC Q100 reliability requirements for automotive optical sensors.