10:50 – 11:00
Open Innovation Strategy of Resonac, Co-Creative Chemical Company
The cutting-edge semiconductors necessary for the evolution of AI are supported by advances in material and equipment technology. The emergence of chiplet package structures has led to increased complexity in packaging, making collaboration between materials and equipment manufacturers more critical than ever.
Resonac, a co-creative chemical company that provides a variety of semiconductor materials such as CMP slurry, etching gas, materials for HBM, epoxy molding compounds, substrate core materials, and more, is advancing materials technology development through open innovation activities. Resonac has started a Packaging Solution Center to propose one-stop solutions for customers and has established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment, and substrates for 2.xD and 3D packages. Additionally, we will soon start an open innovation activity in Silicon Valley called “US-JOINT.” In this presentation, we will describe our co-creation strategy.
Hidenori Abe
Resonac Corporation
Hidenori Abe CTO for semiconductor materials, Resonac Holdings Corporation Executive director, Electronics Business Headquarters, Resonac Corporation. He is leading electronics materials R&D and strategy for semiconductor, substrate and display. Until 2023, he was the head of Electronics R&D Center and Packaging Solution Center, which is open innovation hub in advanced packaging development. I launched JOINT2, new advanced packaging consortium targeting 2.xD and 3D package in 2021.Prior to the above mission, he have been a General Manager of CMP Slurry Business Sector for three years. Before that he was a Manager of Marketing Promotion Group in Innovation Promotion Center at Hitachi Chemical (HC) for 2 years. When the career, he was promoted new R&D projects, especially targeting new business field using new technologies, and also to promote developing R&D products. As a side note, HC is one of the merged companies of Resonac. Hidenori Abe was Manager of Business Development Group in Packaging Solution Center at HC for 1 year with responsibility to promote open laboratory to partners such as customers and equipment makers, responsibility of marketing wearable related materials. Before that, he was epoxy molding compounds (EMC) engineer. During his 16 years carrier as engineer, he spent time doing responsibility of development of non-conductive carbon, green EMC, Cu wire compatible EMC, wafer level compression compounds, power module EMC and so on. His Cu wire compatible EMC development work contributed to the promotion to Cu wire conversion through several published papers. He received a master degree in chemical engineering field from Tokyo Institute of Technology, Japan and a master degree at the EMBA course from Oxford, UK.
Resonac Corporation
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
