14:00 – 14:20
Optimizing Cost and Quality Through Test Mobility Across Insertions
As processor complexity has skyrocketed through the 10B transistor mark on the back of sub-10nm technologies, product developers noticed the outgoing defect rates were impacting end-product quality. To maintain acceptable quality, new test insertions like system level test and active burn-in were added to traditional ATE- based sort and packaged test. Initially a high-volume phenomenon in PCs and smartphones, additional known good die insertions have been added, as multi chip devices have become the norm for AI-enabling servers, resulting in a complex set of unique insertions, each with its own development investment, test limits, and data management. In this session, we’ll discuss how connecting insertions together and enabling test migration across a range of insertions, from wafer to SLT to PCB/product test, offers the opportunity to optimize processes for the desired outcome, whether it be time to market, quality, or cost.
Rick Burns
Teradyne
Rick Burns is the president of the Semiconductor Test Division at Teradyne, overseeing all of Teradyne’s automated test business units. Prior to this role, he was the vice president of Semiconductor Test engineering at Teradyne, where the team consistently created the high-performance hardware and software systems necessary to test the semiconductor industry’s most complex devices. Rick has over 30 years of engineering, engineering management and business leadership experience, and holds a Bachelor of Science degree in physics from the University of California, Los Angeles and a Master of Science degree in electrical engineering from California State University, Northridge.
Company Profile
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Company Products & Services
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
- Semiconductor test systems
- Storage and system-level test systems; Defense and aerospace test instrumentation and systems; Circuit-board test and inspection systems
- Wireless test systems
