• 11:30 – 12:00

Packaging & Integration Requirements and Different Approaches to SiC and GaN Packaging

Moderator

David joined Amkor in 2013 and is currently responsible for Global Product Marketing, Market Analytics and Market Strategy. Prior to joining Amkor, David has held various sales management, product development and engineering positions at FlipChip International (FCI), Leica Microsystems and Agilent Technologies. David has been granted 5 patents in Optoelectronics and Device Packaging and holds a BEng Honors Degree in Electronic, Electrical and Optoelectronic Engineering from University of Glasgow.

As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Panelist
Bernhard Knott photo

Bernhard Knott

Head of Backend Innovation

Infineon Technologies AG

Infineon Technologies AG

Bernhard Knott is the Head of the Infineon Technologies Backend Innovation group. He is responsible for new Package Concepts, Prototyping, new Materials, Simulation and Virtual Prototyping. Until 2016 he was leading the Package Development for Sensors and Waferlevel Package Development in Regensburg, Germany. Prior joining the Backend Organization, he held several Management Position in Frontend Technology dealing with BiCMOS Technologies, Sensors and Innovation projects. After receiving his Diploma in Physics from the University of Regensburg, he started his career in Semiconductor Industry in 1997 in developing an embedded NVM Technology. Bernhard holds several patents and patent applications in the area of FE Technology, Sensors and Packaging.

Bernhard Knott is the Head of the Backend Innovation group at Infineon Technologies AG, Germany. After receiving his Diploma in Physics, he started his career in Semiconductor Industry in 1997 in Frontend and later in Backend Technology Development. Bernhard holds several patents and patent applications in the area of FE Technology, Sensors and Packaging.

 

Here at Infineon, we combine entrepreneurial success with responsible action to make life easier, safer, and greener. Barely visible, semiconductors have become an indispensable part of everyday life. We play a key role in shaping a better future – with microelectronics that link the real and the digital world. Our semiconductors enable efficient energy management, smart mobility, as well as secure, seamless communications in an increasingly connected world. Infineon designs, develops, manufactures and markets a broad range of semiconductors and system solutions. The focus of its activities is on automotive and industrial electronics, communication and information technologies, IoT, sensor technology and security. The product range comprises standard components, software, customer-specific solutions for devices and systems, as well as specific components for digital, analog, and mixed-signal applications.

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Panelist
Joseph Roybal photo

Joseph Roybal

Senior Vice President of Global Backend Operations

Wolfspeed

Wolfspeed

Joseph Roybal is the Senior Vice President of Global Backend Operations at Wolfspeed aligning backend manufacturing roadmaps, production strategies, and capital allocation to scale efficiently with Wolfspeed’s exponential growth. He leads an expanding worldwide team focused on systemic manufacturing solutions, SiC package innovation, strategic partnerships with OSATs, and effective product manufacturing solutions for all Wolfspeed businesses and major SiC backend operations.

Wolfspeed (NYSE: WOLF) leads the market in the worldwide adoption of Silicon Carbide and GaN technologies. We provide industry-leading solutions for efficient energy consumption and a sustainable future. Wolfspeed’s product families include Silicon Carbide materials, power-switching devices and RF devices targeted for various applications such as electric vehicles, fast charging, 5G, renewable energy and storage, and aerospace and defense. We unleash the power of possibilities through hard work, collaboration and a passion for innovation. Learn more at www.wolfspeed.com.

Wolfspeed® is a registered trademark of Wolfspeed, Inc.

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