• 14:10 – 14:40

Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology

Moderator
Fouzun Naseer photo

Fouzun Naseer

Director R&D, Technology, Industry

CREST

Fouzun Naseer had been involved in semiconductor industry over 30 years with wide ranging experience on assembly, test, packaging, manufacturing systems, quality, reliability, material and supplier management. He was previously at Hitachi Semiconductor and Altera Corporation prior to joining CREST. In his current role, he leads R&D group at CREST, and he is also involved in E&E technology and industry development related to Industry 4.0, IC Design, Smart City and Precision Agriculture. He is often engaged for formulation and advocacy of E&E related eco system and directions for various government agencies.

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Collaborative Research in Engineering, Science and Technology (CREST) established in 2012 to catalyst triple helix collaboration between industry, academia and government on E&E technology and ecosystem development. In over 10 years, CREST also undertake talent development initiatives to support E&E industry. Recently, CREST had become an agency under Ministry of Investment, Trade and Industry.

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Panelist
Kam Lee photo

Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service

TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Panelist
Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Panelist
Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel Corporation

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.

As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.

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Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Panelist
Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

Thiagesh K Lingam is the Senior Director for Industrial Development and Technology Transfer at MIMOS Berhad. He plays a crucial role in engaging the Electrical and Electronics industry in Malaysia and globally. His focus is on facilitating technical and commercial interactions to enhance the industry’s competitiveness. With degrees in Electrical and Electronics Engineering and Materials Engineering from the University of Sunderland, UK, and a Lead Auditor qualification, he brings a strong educational background. Over his 25-year career, Mr. Lingam excelled in IC Design, wafer fabrication, Analytical Services, Product Reliability, Embedded Technology, and Rapid Prototyping, working at Chartered Semiconductor and Hitachi Nippon Steel. His proactive, strategic, and problem-solving skills make him a standout leader in the field.

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MIMOS is a leading innovation center in Semiconductors, Microelectronics, and ICT technologies, operating under Malaysia’s Ministry of Science, Technology, and Innovation (MOSTI). It plays a pivotal role in Malaysia’s socio-economic advancement by developing patentable technology platforms, products, and solutions. With over 1,300 filed patents, MIMOS contributes to Malaysia’s international digital transformation efforts and rebranded as MIMOS Global in 2022. The organization focuses on research excellence in Semiconductor & Thin Film Research, Embedded Microelectronics, Manufacturing, and Smart Nation technologies. MIMOS collaborates with strategic partners, explores new opportunities, nurtures technology ventures, and prioritizes innovation, trust, and high performance.

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Panelist
Charng Yee Heng photo

Charng Yee Heng

CEO

Globetronics

Heng Charng Yee is the CEO of Globetronics Technology Berhad. For the past 10 years, she led technology roadmap, product developing, quality and efficiency innovation in the organization’s fastest growing optoelectronics segments. Charng Yee held various role in global strategy, regional expansion and operations, digitalization and operation excellence during her tenure in Tyco Fire and Security. She is current the committee member of FREPENCA and FMM as well as the Industrial Advisor for the Faculty of Business and Finance of UTAR ( University Tunku Abdul Rahman).

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Globetronics Technology Berhad provides Design, Development and Outsource Semiconductor Assembly and Test services. Product portfolio include highly miniaturised optoelectronics, sensors, IC devices and timing devices for mobile, networking, automotive and emerging medical segments. The company is collaborating with leading technology partners in the areas of wafer level packaging, silicon photonics and wafer level MEMS.

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