16:45 – 17:30
Panel Discussion: Marking the Memory Wall a Memory: Prespectives on Technical and Economic Challenges
Moderator
Dr. Ravi Mahajan
Intel Corporation
Ravi Mahajan is an Intel Fellow responsible for Assembly and Packaging Technology Pathfinding for future silicon nodes. Ravi also represents Intel in academia through research advisory boards, conference leadership and participation in various student initiatives. He has led Pathfinding efforts to define Package Architectures, Technologies and Assembly Processes for multiple Intel silicon nodes including 90nm, 65nm, 45nm, 32nm, 22nm and 7nm silicon. Ravi joined Intel in 1992 after earning his Ph.D. in Mechanical Engineering from Lehigh University. He holds the original patents for silicon bridges that became the foundation for Intel’s EMIB technology. His early insights have led to high-performance, cost-effective cooling solutions for high-end microprocessors and the proliferation of photo-mechanics techniques for thermo-mechanical stress model validation. His contributions during his Intel career have earned him numerous industry honors, including the SRC’s 2015 Mahboob Khan Outstanding Industry Liaison Award, the 2016 THERMI Award from SEMITHERM, the 2016 Allan Kraus Thermal Management Medal & the 2018 InterPACK Achievement award from ASME, the 2019 “Outstanding Service and Leadership to the IEEE” Awards from IEEE Phoenix Section & Region 6 and most recently the 2020 Richard Chu ITherm Award and the 2020 ASME EPPD Excellence in Mechanics Award. He is one of the founding editors for the Intel Assembly and Test Technology Journal (IATTJ) and currently VP of Publications & Managing Editor-in-Chief of the IEEE Transactions of the CPMT. He has long been associated with ASME’s InterPACK conference and was Conference Co-Chair of the 2017 Conference. Ravi is a Fellow of two leading societies, ASME and IEEE. He was elected to the National Academy of Engineering in 2022 for contributions to advanced microelectronics packaging architectures and their thermal management.
Intel Corporation
Company Profile
Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.
To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.
Panelist
Akshay Singh Ph.D.
Micron Technology, Inc.
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
- Stanford Graduate School of Business Executive Program, Stanford University
- PhD and MS, Mechanical Engineering, Louisiana State University
- BE, Mechanical Engineering, Maharaja Sayajirao University
Micron Technology, Inc.
Company Profile
Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.
Panelist
Dr. Sanjeev Aggarwal
Everspin Technologies, Inc.
Dr. Sanjeev Aggarwal serves as a member of our Board of Directors and as President and Chief Executive Officer of Everspin. With over 25 years of expertise in the non-volatile memory and semiconductor industry, Sanjeev has been instrumental in shaping Everspin since its inception in 2008 through various leadership positions. Most recently, he served as the Chief Technology Officer driving product and technology roadmaps and business agreements with partners, vendors, and suppliers. As the Vice President of Technology R&D, he directed cross-functional teams to develop and qualify innovative technology and products. As Vice President of Operations, he managed manufacturing operations, supply chain, and managed joint development agreements for technology transfer and production. Before Everspin, Sanjeev was at Freescale Semiconductor and part of the team that spun out to form Everspin Technologies.
Prior to his work on MRAM, Sanjeev successfully developed and commercialized Ferroelectric memories at Texas Instruments. In 2005, he was awarded the Technical Excellence Award by the International Symposium on Integrated Ferroelectrics for his contributions to commercializing FRAM technology. Sanjeev is Senior Member, IEEE and his technical contributions include over 200 issued patents, more than 100 publications and numerous invited presentations. He graduated from Cornell University with a doctorate in Materials Science and Engineering and received his bachelors from Indian Institute of Technology, Varanasi in Ceramic Engineering.
Everspin Technologies, Inc.
Company Profile
Everspin Technologies, Inc. is the world’s leading provider of Magnetoresistive RAM (MRAM). Everspin MRAM delivers the industry’s most robust, highest performance non-volatile memory for industrial IoT, data center, automotive, aerospace and other mission-critical applications where data persistence is paramount. Headquartered in Chandler, Arizona, Everspin provides MRAM solutions to a large and diverse customer base. With an intellectual property portfolio of more than 600 active patents and applications, Everspin leads in the development of products based on perpendicular magnetic tunnel junction (MTJ) STT-MRAM bit cells. With its foundry partner, Everspin has achieved volume production of 300mm wafers down to the 22nm process node. Continued R&D investment in new, fast-growing applications such as use of STT-MRAM in AI inferencing and instant-on systems is creating new opportunity and establishing MRAM as a critical technology in the memory hierarchy.
Panelist
Ji Park
Amkor Technology, Inc.
Ji joined Amkor Technology in 2016 and presently holds the position of Senior Vice President for the Memory Business Unit. In this role, he oversees business and platform development for Memory Products. Ji brings a wealth of experience, having held leadership positions at Qualcomm, Renesas (IDT), Integrated Circuit Systems, and Texas Instruments. He is an accomplished professional, having authored numerous technical papers and being granted four patents. Ji holds a degree in electrical and electronics engineering from the University of Texas at Austin and earned his MBA from the University of Dallas.
Amkor Technology, Inc.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Panelist
Raja Swaminathan, Ph.D.
AMD
Dr. Raja Swaminathan is the Corporate Vice President of Packaging at AMD, spearheading the development of AMD’s advanced packaging and heterogeneous integration roadmap. With a distinguished career spanning roles at Intel, Apple, and now AMD, Dr. Swaminathan’s expertise in design-technology co-optimization and dedication to optimizing power, performance, area, and cost (PPAC) have led to significant technological advancements such as EMIB, Apple’s Mx packages, 3D V-Cache, and 3.5D architectures for AI accelerators. Dr. Swaminathan holds a PhD from Carnegie Mellon University and an undergraduate degree from IIT Madras. With over 100 patents and more than 40 published papers to their name, Dr. Swaminathan was recently recognized as an IEEE Fellow and serves as a technical advisor to multiple startups. His unwavering commitment to heterogeneous integration continues to drive the boundaries of silicon technology.
AMD
Company Profile
For 50 years, AMD has driven in high-performance computing, graphics, and visualization technologies – the building blocks for gaming, immersive platforms, and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit AMD (NASDAQ:AMD) on their website, blog, Facebook and Twitter pages.
