15:00 – 15:25
PANEL SESSION: Bridging the Gap Between R&D and Industry to Enhance Workforce Development
Moderator
Ken Shibata
Ken Shibata has been immersed in the semiconductor industry since 1980. He initiated his career at a manufacturing company within Hitachi Semiconductor Division, where he spent the first decade as a backend assembly process engineer. Over the subsequent 10 years, he played a pivotal role in promoting the OSAT business. From 2001 to 2014, Ken contributed significantly to Amkor Technology Japan, ultimately holding the position of Representative Director and Sales VP. Following this, he served as Representative Director and Senior Vice President at UTAC Japan from November 2014 to June 2019. Ken joined ISES on October 15, 2023.
Panelist
Nahomi Aoto, Ph.D.
Hiroshima University
Nahomi Aoto is working from 2023 at Hiroshima University as Professor by Special Designation and at Tohoku University as Specially Appointed Visiting Professor. She specializes in workforce advancement of university students and younger students by attracting them to semiconductor technology and industry. Her enthusiasm for this job is based on her forty-year-experiences of semiconductor R&D at device manufacturers, NEC, Elpida Memory and Micron, from engineer to executive. She has also been encouraging women to take leadership in this industry and our society.
Hiroshima University
Panelist
Dr. Kazuaki Sawada
Toyohashi University of Technology
Kazuaki Sawada was born in Kumamoto, Japan in 1963. He received a Ph.D. degree in system and information engineering in 1991, from Toyohashi University of Technology, Aichi, Japan. Doctor of Engineering.
From 1991 to 1998, he was an Assistant Professor in the Research Institute of Electronics, Shizuoka University, Shizuoka, Japan. Since 1998, He was a lecturer at the Department of Electrical and Electronic Engineering, Toyohashi University of Technology from 1991 to 1998, an associate professor in 2000 and a professor at the Faculty of Engineering, Toyohashi University of Technology since 2007. In 2005, he was a visiting professor at the Technical University of Munich.
Prof. Sawada was Director of the Venture Business Laboratory and Director of the Incubation Facility from 2008 to 2014, Assistant to the university president as a Director of the KOSEN Collaboration Office in 2016, Director of the Electronics-Inspired Interdisciplinary Research Institute (EIIRIS) from 2014 to 2016. He is currently Director of the Institute for Research in Next-Generation Semiconductors and Sensing Science (IRES²) from 2023.
In 2009, he received the 65th Electrical Society of Japan Award for the Promotion of Electric Science (Progress Award). In 2013, he received the Commendation for Science and Technology by the Minister of Education, Culture, Sports, Science and Technology (Research Category). His current research focuses on smart sensors that integrate integrated circuit technology and sensor technology. In particular, he is developing non-label bio-imaging sensing devices and multimodal sensors by integrating bio-related technologies and integrated circuit technologies.
1963年熊本県生まれ。1991年豊橋技術科学大学大学院工学研究科博士後期課程システム情報工学専攻修了、工学博士。1991年から1998年静岡大学電子工学研究所助手。同年豊橋技術科学大学電気・電子工学系講師。2000年同准教授。2005年ミュンヘン工科大学客員教授。2007年より豊橋技術科学大学工学部教授。
2008年から2014年 ベンチャー・ビジネス・ラボラトリーセンター長、インキュベーション施設長、2014年から2016年 同大学長補佐 高専連携室長、2016年同大学 エレクトロニクス先端融合研究所（EIIRIS）所長、2023年から現在 同大学 次世代半導体・センサ科学研究所（IRES²）所長。
2009年 電気学会 第65回電気学術振興賞（進歩賞）受賞。
2013年 文部科学大臣表彰科学技術賞（研究部門）受賞。 現在の研究テーマは、集積回路技術とセンサ技術を融合したスマートセンサに関する研究。特に、バイオ関連技術と集積回路技術を融合したノンラベル生体画像センシングデバイスおよびマルチモーダルセンサの開発。
Toyohashi University of Technology
Panelist
Tetsuo Endoh, Ph.D.
Tohoku University Center for Innovative Integrated Electronic Systems
Tetsuo Endoh graduated University of Tokyo in 1987 and received Ph. D degree from Tohoku University Graduate School of Engineering in 1995. He joined ULSI Research Center Toshiba Co. in 1987 and was engaged in both the R&D and the mass production of NAND Memory. He is a professor at the Department of Electrical Engineering, the Graduate School of Engineering, Tohoku University and director of the Center for Innovative Integrated Electronic Systems (CIES). His current interests are 3D structured device, novel memory, beyond-CMOS technology including spintronics, power-device and power electronics with GaN or SiC. He was a Fellow of the IEEE from 2023 for contributions to nonvolatile memory and spintronic logic.
Tohoku University Center for Innovative Integrated Electronic Systems
Company Profile
The Center for Innovative Integrated Electronic Systems (CIES) has conducted the CIES consortium consisting of industry-academia joint researches, major national projects, and regional collaboration projects from fields such as materials, equipment, devices, circuits and systems through the cooperation of domestic and foreign companies with support of local government. CIES has expanded its R&D field from spintronics to AI hardware and power electronics, and has promoted to develop core technologies related to integrated electronics. To date, the center has developed various innovative technologies with highest performance in the world, has made progress in developing IoT and AI systems that require ultra-low power consumption. In addition, with the establishment of the startup “Power Spin Inc.” from Tohoku University, we are accelerating the development of the innovative technologies that we are developing into social implementation and the further advancement of industry-academia collaboration. In June 2021, Tohoku University established the Tohoku University Semiconductor Technology Co-creation to contribute to Japan’s semiconductor strategy and the world’s energy-saving society. In addition to this co-creation, CIES is positioned as a spintronics low power logic semiconductor development base in Japan’s semiconductor strategy, and is further strengthening efforts for promotion of industry-academia-government co-creation and social implementation. We will continue to create innovative core technologies and contribute to the industry and the enhancement of global competitiveness by the practical applications, and “new creation and innovation” through global and regional partnership.
