27-28 August 2025
Suwon
17:20 – 17:30
Preparing for GaN Device Manufacturing at 300mm
GaN is one of the most important third generation semiconductor materials. Its wide bandgap makes it an excellent candidate for high power electronics – GaN high electron mobility transistors (HEMTs) have already become well established in Specialty Technology applications such as consumer fast charging and are gaining traction in automotive.
Today, the most advanced GaN device manufacturing is performed on 200mm wafers. But the recent advances in 300mm GaN on Silicon MOCVD is ushering the next phase of GaN adoption at the larger wafer size. Of increasing interest, is the fabrication of low voltage GaN power electronics targeted at data center power management applications, as the rapidly emerging world of generative AI accelerates datacenter investment.
Lam has been a leader in Specialty Technologies, in the development of enabling process capabilities for 200mm GaN on Si fabrication, for almost a decade. In this paper, we will review the current status of these capabilities and discuss the challenges and opportunities for transitioning GaN from 200mm to 300mm production.
Michelle Bourke
Lam Research Corporation
Michelle Bourke received her B.Sc. degree in Optoelectronics and Laser Engineering from Heriot-Watt University in Scotland, UK. Subsequently she joined the Defence Evaluation and Research Agency (DERA), where she worked on advanced processing methods for GaAs/AlGaAs optoelectronic devices. In 1997 she entered the semiconductor capital equipment industry as a technologist and has since accrued more than 25 years of experience in semiconductor technology, strategy, and new product development. She is a specialist in fabrication technologies for MEMS, Power Devices, RF Electronics and Optoelectronics. Michelle is a frequent presenter at leading industry forums and also serves on many committees and industry councils. In November of 2018, she was inducted into the Semi MEMS and Sensors Industry Group Hall of Fame and in 2020 she was a Silicon Valley YWCA Tribute to Women Honoree. Michelle is currently Chair of the Semi MEMS Manufacturing Working Group, Co-chair of the Semi MEMs Standards Committee and a Director on the Transducers Research Foundation Board where she is the Chair of Fund Raising and Development Committee. Michelle joined Lam Research in 2015 and is currently Managing Director of Specialty Technologies and Strategic Marketing in Lam’s Customer Support Business Group.
Lam Research Corporation
Company Profile
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
Company Products & Services
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.