- 16:30 – 16:45
Process Control Challenges in Packaging for High Performance Computing Applications
As the pace of Moore’s law slows, and the associated development cost increases, the industry has turned to advanced packaging to enable the improvement of the overall system performance, whilst also reducing cost. A key trend is the adoption of a “chiplet” approach, with panel level packaging and hybrid bonding being the two key advanced packaging enablers for the heterogenous integration. In this presentation, we will discuss the challenges and solutions for process control as well as the importance of chiplet genealogy.
Dr. Monita Pau
Dr. Monita Pau is Strategic Marketing Director for Advanced Packaging at Onto Innovation. Prior to joining Onto, she held various application engineering, marketing and strategic business development roles at DuPont and KLA. Her expertise spans across FOEL/BEOL process control solutions as well as advanced packaging and assembly materials serving both core and specialty semiconductor markets. Dr. Pau holds a Ph.D. degree in Chemistry from Stanford University.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
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