• 13:45 – 14:05

System-level Packaging: Challenges and Solutions

The trend of connecting heterogeneous circuits/subsystems and integrating them into a system using packaging technology has been an ongoing effort in many semiconductor applications, including computing, networking, artificial intelligence (AI), mobile and automotive. In the computing, networking and AI domains, technologies such as chiplets have emerged in the market to achieve increased yield in wafer fabrication. In addition, newpackaging solutions like interposer technologies have been actively developed in semiconductor packaging areas, enabling chiplet device integration in packages. In the mobile sector, as the demand for miniaturization, low power consumption and low cost continues to rise, ongoing systemization efforts are centered around processors, memories, and RF front-end devices. At the same time, efforts to pursue high-speed, high-memory capacities are driven by the emerging market demand for AI services. Finally, automobiles are becoming more of an electronic product than a mechanical one withmany built-in electronic components. Today’s vehicles require a variety of electronic products, such as central processing units (CPUs) for data processing, microcontroller units (MCUs) for powertrain control, sensors for comfort and driving convenience, and power modules for driving motors. Some of these components require systemization. However, automotive components operate in a rugged environment and require a high level of reliability for safe driving, so verified technology and platforms should be implemented in system integration. This presentation will review the technical requirements and challenges that arise during the systemization process for each of these applications and discuss potential solutions.

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Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

JinYoung joined Amkor Technology in 2000 and is currently Sr. Vice President, Global R&D Strategy. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.

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